Observation device and observation method

Abstract

An observation device (1) for observing a portion near the end of a wafer (10), comprising an imaging section (40) for imaging an image near the end of a wafer (10) from the extending direction of the wafer (10), and an image processing section (50) for detecting the edge of a film formed on the surface of the wafer (10) is further provided, as an illumination section for illuminating a portion near the end of a wafer (10), with an epi-illumination source (48) for illuminating a portion near the end of a wafer (10) via an observation optical system (41), and a diffusion illumination source (31) arranged to face the surface of the wafer (10) and illuminate a portion near the end of a wafer (10) using diffused light.

Description

[0001]This is a continuation of PCT International Application No. PCT / JP2009 / 058271, filed on Apr. 27, 2009, which is hereby incorporated by reference. This application also claims the benefit of Japanese Patent Application No. 2008-118931, filed in Japan on Apr. 30, 2008, which is hereby incorporated by reference.TECHNICAL FIELD[0002]The present invention relates to an observation device and an observation method for observing semiconductor wafers, liquid-crystal glass substrates, and other substrates.TECHNICAL BACKGROUND[0003]Over the past several years, the degree of integration of circuit element patterns formed on a semiconductor wafer is progressing and the types of thin films used in wafer surface treatments in semiconductor manufacturing steps is increasing. In accordance therewith, it is becoming increasingly important to detect defects near the end of a wafer where the edge (boundary portion) of the thin film is exposed. When foreign matter is present near the end of a waf...

AI Technical Summary

Benefits of technology

The present invention provides an observation device and observation method that can accurately detect the edge of a film formed on the surface of a substrate. The observation device includes an imaging section and an illumination section, and the imaging section has a focal point changing section to modify the focal position on the substrate. The observation device can position the edge of the film on the substrate and detect it using an image of the substrate's end. The invention solves the problem of accurately detecting the edge of a film when using a high-speed optical system with a low numerical aperture.

Problems solved by technology

When foreign matter is present near the end of a wafer, it wraps around to the surface side of the wafer, produces an adverse effect in later steps, and affects the yield of circuit elements created from a wafer.

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