Method to enhance polishing performance of abrasive charged structured polymer substrates

a structured polymer substrate and polishing technology, applied in the direction of grinding/polishing apparatus, manufacturing tools, lapping machines, etc., can solve the problems of reducing the hydrodynamic pressure countering the applied preload, the difficulty of generating continuous and concentric grooves spaced with 30-100 nm, and the difficulty of manufacturing viewpoints to achieve such feature size, etc., to enhance the adhesion of lubricant, enhance the lubrication of the interface, and enhance the lub
US20120064808A1Inactive Publication Date: 2012-03-15SCHWAPPACH KARL

Patent Information

Authority / Receiving Office
US Ā· United States
Patent Type
Applications(United States)
Current Assignee / Owner
SCHWAPPACH KARL
Publication Date
2012-03-15
Estimated Expiration
Not applicable Ā· inactive patent

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Abstract

The intersection of discrete polishing islands staggered in a curvilinear shape with a workpiece maintains a substantially uniform film thickness throughout the polishing operation and also leading to a stable polishing operation due to the substantially invariant pressurization.
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Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefits of the filing date of U.S. Provisional Patent Application Ser. No. 61 / 315,210 filed Mar. 18, 2010, which is entitled ā€œMethod to Enhance Polishing Performance of Abrasive Charged Structured Polymer Substratesā€ and U.S. Provisional Patent Application Ser. No. 61 / 315,237 filed Mar. 18, 2010, which is entitled ā€œMethod to Enhance Polishing Performance of Abrasive Charged Polymer Substratesā€ both of which are hereby incorporated herein in their entirety by reference.FIELD OF THE INVENTION

[0002] The present invention is directed to a method and apparatus for an abrasive article with a plurality of polishing islands arranged to generate a constant contact area during polishing.BACKGROUND

[0003] Polishing with polyamide or other polymer based substrate materials requires maintaining a constant hydrodynamic film for stability during the polishing operation and reducing the required hydrodynamic film is attainable b...

Claims

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