The invention discloses a stepped
grinding and
polishing processing method for regulating and controlling the removal scale of a plastic domain by a
magnetic field, which comprises the following steps: starting an
electromagnet device, regulating current to generate a
magnetic field vertical to the surface of a workpiece, and enhancing the plastic domain range of the
surface layer of the workpiece; the
grinding depth of the
grinding wheel is controlled to be larger than zero and smaller than the magnetic brittle-plastic transformation critical
cutting depth, and grinding is conducted; the grinding depth of the
grinding wheel is controlled to be zero, magnetic force rheological grinding and
polishing liquid is supplied to a grinding area, and grinding-
polishing combined
machining is conducted on the surface of the workpiece; controlling the clearance between the
grinding wheel and the workpiece surface to be greater than zero, and adjusting the
magnetic field intensity according to the clearance to control the
shear stress of the
abrasive cluster; the
abrasive clusters are formed by the synergistic effect of magnetic field force and a
hydrodynamic pressure field; and the polishing depth is controlled to be smaller than the magnetic brittle-
plasticity transformation critical
cutting depth by adjusting the
grinding wheel feeding depth, the rotating speed and the workpiece feeding speed, and the surface of the workpiece is polished. According to the method, the damage depth can be quantitatively controlled, positioning errors caused by secondary clamping are avoided, and the method is high in universality and easy to implement.