The invention provides a hydrodynamic pressure suspension polishing device with a machining clearance capable of being adjusted. The polishing device comprises a lifting part and a polishing part. The lifting part mainly comprises rolling guide rails, a ball screw, a base, a middle supporting plate, an upper cover plate and a stepper motor. The stepper motor transmits torque through the ball screw to drive the middle supporting plate to go up and down. The polishing part mainly comprises a polishing disk, a ball spline shaft, springs, fine tuning knobs, a movable plate, a middle supporting plate, a guide rail, a servo motor and the like. The servo motor enables the polishing disk to rotate at a high speed through a belt wheel. The weight of the movable plate, the weight of the ball spline shaft and the weight of the polishing disk are overcome by the springs. The distance between the polishing disk and a container is adjusted through the fine tuning knobs. When the hydrodynamic pressure is increased, the polishing disk, the ball spline shaft and the movable plate float upwards overall, and when the hydrodynamic pressure is decreased, the polishing disk, the ball spline shaft and the movable plate descend overall, so that the adaptive suspension of the polishing disk during polishing is achieved. The movement of the movable plate is limited through a limiting threaded rod, and thus the fixed clearance is machined. According to the hydrodynamic pressure suspension polishing device, the machining efficiency is improved, and meanwhile the adjustability of the machining clearance is achieved.