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Opener for extreme ultra violet lithography reticle pods

a technology of reticle pods and openers, which is applied in the field of photolithographic manufacturing equipment, can solve the problems of reducing image quality, storing and carrying bare glass reticle pods, etc., and achieves the effects of convenient maintenance, easy manufacturing, and cost-effectiveness

Inactive Publication Date: 2013-02-21
WU KUNG CHRIS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention relates to a new opener for a pod that contains a bare photolithographic reticle. The opener is designed to be simple and to prevent contamination of the reticle. The technical effects of the invention are to improve the efficiency and accuracy of the photolithography process.

Problems solved by technology

When using an extra deep UV (“EUV”) light source, that is necessary for printing a lithographic pattern having line widths below 22 nm on a product, the pellicle's film distorts and / or absorbs the light thereby diminishing image quality.
Removing the pellicle film from the reticle to accommodate 22 nm or narrower line width lithographic printing creates a problem for storing and carrying bare glass reticles while concurrently avoiding particle contamination when using the photo mask.

Method used

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  • Opener for extreme ultra violet lithography reticle pods
  • Opener for extreme ultra violet lithography reticle pods
  • Opener for extreme ultra violet lithography reticle pods

Examples

Experimental program
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Embodiment Construction

[0050]The two stage EUV pod openers disclosed herein are adaptations of existing opener mechanisms marketed commercially by Fortrend Engineering Corporation respectively:[0051]1. identified by the general reference number 42 in FIG. 3A for opening and closing the SEMI standard E-19.4 200 mm RSP 32; or[0052]2. identified by the general reference number 44 in FIG. 3B for opening and closing the SEMI standard E-100 150 mm RSP 34.

The adaptation of the standard Fortrend Engineering Corporation RSP pod openers 42, 44 adds a second mechanism for opening the inner metal case 20 the after opening the RSPs 32, 34. In other words, the EUV pod opener disclosed herein has two sub-assemblies. The first assembly (the existing RSP pod openers 42, 44) is the mechanism that opens the RSPs 32, 34; and the second assembly, an inner casing opener, is a mechanism that opens the metal case 20. Since the metal case 20 cannot be accessed until the RSPs 32, 34 has been opened, the following section describes...

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PUM

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Abstract

A two stage opener (50) for an EUV RSP (32, 34) includes an outer RSP pod opener (42, 44) having:1. a RSP latch mechanism (42rlm) for latching a sealed outer RSP pod (32, 34) in place on the RSP pod opener (42, 44) and2. a RSP lock / unlock mechanism (42lulm) for unlocking the RSP pod (32, 34) so the RSP pod opener (42, 44) can separate a RSP pod cover (32c, 343c) from a RSP pod door (32d, 34d).After the RSP lock / unlock mechanism (42lulm) unlocks the RSP pod (32,34), the RSP pod opener (42, 44) separates the RSP pod door (32d, 34d) from the RSP pod cover (32c, 34c) thereby exposing a metal case (20). The pod opener (50) also includes a metal case opener (52) having at least two (2) arms (56) for receiving and supporting the metal case cover (22) while the two stage pod opener (50) separates the metal case base (24) from the metal case cover (22) thereby exposing the hare reticle (26) carried on the metal case base (24).

Description

TECHNICAL FIELD[0001]The present disclosure relates generally to the technical field of photolithographic manufacturing equipment and, more particularly, to openers for pods that enclose a photolithographic reticle.BACKGROUND ART[0002]As semiconductor line width continue shrinking below 22 nm circuit printing lithography tools can no longer use a conventional photo mask (also known as the reticle) that is covered by a pellicle film. When using an extra deep UV (“EUV”) light source, that is necessary for printing a lithographic pattern having line widths below 22 nm on a product, the pellicle's film distorts and / or absorbs the light thereby diminishing image quality. To avoid pattern distortion, exposing a lithography pattern having line widths below 22 nm requires using both:[0003]1. the EUV light source; and[0004]2. a bare glass photo mask.[0005]Historically, a protective pellicle film has been a critical for preventing particles from landing directly on the photo mask patterned gl...

Claims

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Application Information

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IPC IPC(8): A47B81/00
CPCG03F1/66
Inventor WU, KUNG CHRIS
Owner WU KUNG CHRIS