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Magnetic structures, methods of forming the same and memory devices including a magnetic structure

a magnetic structure and memory technology, applied in the field of magnetic structures, methods of forming the same, and memory devices including magnetic structures, can solve the problems of difficult to increase the recording density of the mram, difficult to secure the data retention characteristic, etc., and achieve the effect of increasing the magnetic anisotropy energy of the magnetic layer and increasing the thermal stability of the magnetic layer

Inactive Publication Date: 2013-07-11
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent text describes a way to make magnetic materials that are more resistant to changes in temperature. This can be useful for creating components that are more reliable and durable.

Problems solved by technology

Thus, securing a data retention characteristic becomes difficult.
In this regard, it is not easy to increase the recording density of the MRAM over a certain level.

Method used

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  • Magnetic structures, methods of forming the same and memory devices including a magnetic structure
  • Magnetic structures, methods of forming the same and memory devices including a magnetic structure
  • Magnetic structures, methods of forming the same and memory devices including a magnetic structure

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Embodiment Construction

[0072]Various example embodiments will now be described more fully with reference to the accompanying drawings in which example embodiments are shown.

[0073]It will be understood that when an element is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present. As used herein the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0074]It will be understood that, although the terms “first”, “second”, etc. may be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or secti...

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Abstract

Magnetic structures, methods of forming the same, and memory devices including a magnetic structure, include a magnetic layer, and a stress-inducing layer on a first surface of the magnetic layer, a non-magnetic layer on a second surface of the magnetic layer. The stress-inducing layer is configured to induce a compressive stress in the magnetic layer. The magnetic layer has a lattice structure compressively strained due to the stress-inducing layer.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of priority from Korean Patent Application No. 10-2012-0002041, filed on Jan. 6, 2012, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.BACKGROUND[0002]1. Field[0003]Example embodiments relate to magnetic structures, methods of forming the same, and memory devices including a magnetic structure.[0004]2. Description of the Related Art[0005]Magnetic random access memories (MRAMs) are memory devices that store data by using a variation in resistance of a magnetic tunneling junction (MTJ) element of a memory cell. The resistance of the MTJ element varies according to a magnetization direction of a free layer. That is, when the magnetization direction of the free layer is the same as a magnetization direction of a pinned layer, the MTJ element has low resistance. When the magnetization direction of the free layer is opposite to the magneti...

Claims

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Application Information

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IPC IPC(8): H01L29/82G11B5/66H01F41/14G11B5/65
CPCG11C11/161H01L43/08H01L43/12H01L27/228B82Y40/00H01F10/3254H01F10/3286H01F41/302H01F10/30G11C11/1675H10B61/22H10N50/10H10N50/01G11C11/15H10N50/80
Inventor KIM, KWANG-SEOKLEE, SUNG-CHUL
Owner SAMSUNG ELECTRONICS CO LTD