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Light-emitting diode packaging structure of low angular correlated color temperature deviation

a technology of light-emitting diodes and packaging structures, applied in the direction of basic electric elements, electrical apparatus, semiconductor devices, etc., can solve the problems of low optical performance, and achieve the effect of reducing the angular correlated color temperature deviation and long optical path length

Active Publication Date: 2013-09-19
NAT CENT UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides an LED packaging structure that reduces the temperature deviation of emitted light. This is achieved by using a phosphor body with an extension portion that increases the distance between the LED chip and the phosphor body. This increases the optical path length of the light, resulting in a more uniform color temperature. Overall, this improves the efficiency and quality of LED packaging structures.

Problems solved by technology

Although the aforesaid method is flawed with low optical performance of the white light produced, it is advantageously effective in cutting white LED manufacturing costs.
Still, an LED packaging structure that ensures high uniformity in light mixing at every angle remains unavailable.

Method used

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  • Light-emitting diode packaging structure of low angular correlated color temperature deviation
  • Light-emitting diode packaging structure of low angular correlated color temperature deviation
  • Light-emitting diode packaging structure of low angular correlated color temperature deviation

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Embodiment Construction

[0022]Referring to FIG. 4 and FIG. 5, there are shown a perspective view and a cross-sectional view of a light-emitting diode (LED) packaging structure 10 of low angular correlated color temperature deviation according to an embodiment of the present invention, respectively. The LED packaging structure 10 comprises a substrate 20, an LED chip 30, a phosphor body 40, and a transparent lens 50.

[0023]The substrate 20 is a circuit substrate, such as an aluminum circuit substrate, a ceramic circuit substrate, or a PCB circuit substrate. In general, the substrate 20 in wide use is an aluminum circuit substrate or a PCB circuit substrate.

[0024]The LED chip 30 has an upper surface 31. The LED chip 30 is mounted on the substrate 20 by a die mounting process. Afterward, in a wire bonding process the LED chip 30 is electrically connected to a circuit structure on the substrate 20 by metal wires (not shown).

[0025]The phosphor body 40 is a gel mixture of phosphor materials and silicone gel. The ...

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PUM

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Abstract

A light-emitting diode (LED) packaging structure having low angular correlated color temperature deviation includes: a substrate, a LED chip, a phosphor body, and a transparent lens. The LED chip is disposed on the substrate, and the phosphor body includes a hemisphere body and an extension part extended from the bottom of the hemisphere body. The phosphor body is disposed on the substrate and covers the LED chip. Besides, the transparent lens is disposed outside the phosphor body to cover the phosphor body to increase light extraction efficiency. With the implementation of the present invention, the setup of the extension part makes a longer vertical distance between the LED chip and the top of the phosphor body, so that the light in the normal direction of the LED chip can have a longer optical length, thereby to reduce the angular correlated color temperature deviation.

Description

BACKGROUND OF THE INVENTION[0001]1. Technical Field[0002]The present invention relates to light-emitting diode (LED) packaging structures of low angular correlated color temperature deviation, and more particularly, to a light-emitting diode (LED) packaging structure of low angular correlated color temperature deviation, wherein the LED packaging structure is capable of mixing light uniformly.[0003]2. Description of Related Art[0004]Due to technological advancement, white LED manufacturing methods abound. For example, white light is produced by mixing light with a red LED chip, a green LED chip, and a blue LED chip or by exciting red phosphor materials, green phosphor materials, and blue phosphor materials with an ultraviolet LED chip. At present, the commonest white LED packaging method involves covering the blue LED chip with a phosphor body that contains yellow phosphor materials and exciting yellow phosphor materials with blue light so as to produce white light. Although the afo...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L33/50
CPCH01L33/505H01L33/58H01L2924/0002H01L2924/00
Inventor SUN, CHING-CHERNGCHEN, CHING-YICHIU, CHIH-YU
Owner NAT CENT UNIV
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