Light-emitting diode packaging structure of low angular correlated color temperature deviation

a technology of light-emitting diodes and packaging structures, applied in the direction of basic electric elements, electrical apparatus, semiconductor devices, etc., can solve the problems of low optical performance, and achieve the effect of reducing the angular correlated color temperature deviation and long optical path length
US20130240926A1Active Publication Date: 2013-09-19NAT CENT UNIV
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
NAT CENT UNIV
Publication Date
2013-09-19

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Abstract

A light-emitting diode (LED) packaging structure having low angular correlated color temperature deviation includes: a substrate, a LED chip, a phosphor body, and a transparent lens. The LED chip is disposed on the substrate, and the phosphor body includes a hemisphere body and an extension part extended from the bottom of the hemisphere body. The phosphor body is disposed on the substrate and covers the LED chip. Besides, the transparent lens is disposed outside the phosphor body to cover the phosphor body to increase light extraction efficiency. With the implementation of the present invention, the setup of the extension part makes a longer vertical distance between the LED chip and the top of the phosphor body, so that the light in the normal direction of the LED chip can have a longer optical length, thereby to reduce the angular correlated color temperature deviation.
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Description

BACKGROUND OF THE INVENTION

[0001] 1. Technical Field

[0002] The present invention relates to light-emitting diode (LED) packaging structures of low angular correlated color temperature deviation, and more particularly, to a light-emitting diode (LED) packaging structure of low angular correlated color temperature deviation, wherein the LED packaging structure is capable of mixing light uniformly.

[0003] 2. Description of Related Art

[0004] Due to technological advancement, white LED manufacturing methods abound. For example, white light is produced by mixing light with a red LED chip, a green LED chip, and a blue LED chip or by exciting red phosphor materials, green phosphor materials, and blue phosphor materials with an ultraviolet LED chip. At present, the commonest white LED packaging method involves covering the blue LED chip with a phosphor body that contains yellow phosphor materials and exciting yellow phosphor materials with blue light so as to produce white light. Although the afo...

Claims

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