Substrate treatment apparatus and substrate treatment method
a substrate treatment and treatment apparatus technology, applied in the direction of instruments, cleaning using liquids, inorganic non-surface active detergent compositions, etc., can solve the problem of resist damage to the front surface of the wafer uncovered with resist, and achieve the effect of strong oxidative power
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example 1
[0083]The flow rate ratio (weight ratio) between the sulfuric acid ozone (SOM) and the DIW in the sulfuric acid ozone / water mixture was 1:0.15 by way of example.
[0084]The liquid temperature (treatment temperature) of the sulfuric acid ozone / water mixture spouted from the sulfuric acid ozone / water nozzle 5 after the mixing was 134° C.
example 2
[0085]The flow rate ratio (weight ratio) between the sulfuric acid ozone and the DIW in the sulfuric acid ozone / water mixture was 1:0.3 by way of example. The liquid temperature (treatment temperature) of the sulfuric acid ozone / water mixture spouted from the sulfuric acid ozone / water nozzle 5 after the mixing was 151° C.
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