Heat sink
a technology of heat sinks and sinks, which is applied in the direction of lighting and heating apparatus, cooling/ventilation/heating modifications, semiconductor devices, etc., can solve the problems of reducing the operational life of electrical components, affecting the performance of electrical components, and many electrical components generating heat during operation, so as to increase the velocity of air flow
Inactive Publication Date: 2014-06-05
TE CONNECTIVITY CORP
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- Claims
- Application Information
AI Technical Summary
Benefits of technology
The patent describes a heat sink and a receptacle assembly for a pluggable module. The heat sink has a base with a cooling fin that extends out from it. The cooling fin has the shape of an airfoil, which helps increase the speed of air flow. This design helps to improve the heat transfer and cooling efficiency of the pluggable module.
Problems solved by technology
Specifically, many electrical components generate heat during operation.
The heat can build up to an extent that the operating temperature of an electrical component negatively affects the performance of the electrical component.
Higher operating temperatures may also decrease the operational life of an electrical component.
But, known heat sinks may not promote balanced heat transfer along the heat sink.
Such unbalanced heat transfer may cause the electrical component to be unevenly cooled, which may cause one or more areas of the electrical component to be inadequately cooled.
Method used
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Embodiment Construction
[0018]FIG. 1 is a perspective view of an exemplary embodiment of a heat sink 10. The heat sink 10 includes a base 12 and one or more cooling fins 14 that extend outward from the base 12. As will be described in more detail below, at least one of the cooling fins 14 includes the shape of an airfoil to increase the velocity of air flowing over the heat sink 10.
[0019]In the exemplary embodiment, the heat sink 10 has the general shape of a rectangle and extends a length along a central longitudinal axis 16 from a front end 18 to a rear end 20 that is opposite the front end 18. The heat sink 10 extends a width along a central latitudinal axis 22 from a side end 24 to an opposite side end 26 in the exemplary embodiment. The heat sink 10 is not limited to the rectangular shape shown herein. Rather, the heat sink 10 may additionally or alternatively include any other shape, such as, but not limited to, another rectangular shape (e.g., a square shape), a circular shape, an oval shape, shape ...
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A heat sink includes a base having a structure side and an opposite environmental side. The structure side of the base is configured to thermally communicate with a structure for absorbing heat from the structure. A cooling fin extends a height outwardly from the environmental side of the base. The cooling fin extends a cord length along the base from a leading edge to a trailing edge of the cooling fin. The cooling fin includes the cross-sectional shape of an airfoil along at least a portion of the height of the cooling fin to increase the velocity of a flow of air along the cord length of the cooling fin.
Description
BACKGROUND OF THE INVENTION[0001]The subject matter described and / or illustrated herein relates generally to heat sinks.[0002]The performance of many electrical components (e.g., pluggable modules sometimes referred to as “transceivers”) may be dependent upon the temperature at which the electrical component operates. Specifically, many electrical components generate heat during operation. The heat can build up to an extent that the operating temperature of an electrical component negatively affects the performance of the electrical component. For example, the speed at which a processor processes signals may be reduced when the processor operates at higher operating temperatures. Higher operating temperatures may also decrease the operational life of an electrical component. Accordingly, it may be desirable to cool an electrical component during operation thereof.[0003]Heat sinks are often used to cool electrical components. A heat sink may include a base and one or more cooling fin...
Claims
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IPC IPC(8): F28F3/02
CPCF28F3/02H01L23/367H01L23/4006H01L23/467H01L2924/0002H01L23/3672H05K7/20F28F2250/02H01L2924/00
Inventor NICHOLS, ROBERT, PAUL
Owner TE CONNECTIVITY CORP