Heat dissipating device

Inactive Publication Date: 2014-07-03
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0017]By means of the design of the structure of the present invention, the structure of corresponding communication between the first chamber of the first body and the second chamber of the second body, when the first body is heated, the liquid working fluid is heated and vaporized into vapor. Then, part of the vapor working fluid in the first chamber flows

Problems solved by technology

Therefore, if the heat generated can not be dissipated promptly, it will affect the effective operation of the electronic device or cause damage to the electronic components.
However, th

Method used

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Embodiment Construction

[0026]The above objectives and structural and functional features of the present invention will be described with reference to the accompanying drawings.

[0027]Please refer to FIGS. 1A and 1B, which are the assembled perspective view and cross-sectional view of the heat dissipating device according to the first embodiment of the present invention, respectively. The heat dissipating device comprises a first body 1, a second body 2, and a working fluid 3. The first body 1 has a first plate 10 and a second plate 11 disposed opposite to the first plate 10, the first plate 10 and the second plate 11 combined with each other to together define a first chamber 101, a first wick structure 102 being formed on the inner wall of the first chamber 101. The first wick structure 102 can be one of sintered powder, mesh, fiber, foam and porous material. The first body 1 further has a hole 103.

[0028]The above-mentioned second body 2 connects the first body 1 and extends opposite to the first body 1. ...

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Abstract

A heat dissipating device comprises a first body, a second body, and a working fluid, the first body having a first plate and a second plate combining with each other to together define a first chamber, the second body connecting the first body and having a second chamber communicating with the first chamber correspondingly, the working fluid filled in the first chamber and the second chamber. By means of the design of the structure of the present invention and through the circulation of the working fluid between the first chamber and the second chamber, the heat dissipating device of the present invention can achieve the effect of remote heat dissipation.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a heat dissipating device, and in particular to a heat dissipating device with remote heat dissipation and an extended range of heat dissipation.[0003]2. Description of Prior Art[0004]With the rapid progress of technology industry, the functions of electronic devices are more and more powerful; for example, the operational speeds of the electronic components in the central processing unit (CUP), chip set, and display unit increase accordingly. As a result, the heat generated per unit time by the electronic components is getting higher. Therefore, if the heat generated can not be dissipated promptly, it will affect the effective operation of the electronic device or cause damage to the electronic components.[0005]The general heat dissipating devices used for the electronic components to remove heat in industry are mainly the heat dissipating components such as fans, heat sinks and heat pi...

Claims

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Application Information

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IPC IPC(8): F28D15/02
CPCF28D15/02F28D15/04F28D2021/0028
Inventor YANG, HSIU-WEI
Owner ASIA VITAL COMPONENTS SHENZHEN CO LTD
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