Heat dissipating device

Abstract

A heat dissipating device comprises a first body, a second body, and a working fluid, the first body having a first plate and a second plate combining with each other to together define a first chamber, the second body connecting the first body and having a second chamber communicating with the first chamber correspondingly, the working fluid filled in the first chamber and the second chamber. By means of the design of the structure of the present invention and through the circulation of the working fluid between the first chamber and the second chamber, the heat dissipating device of the present invention can achieve the effect of remote heat dissipation.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a heat dissipating device, and in particular to a heat dissipating device with remote heat dissipation and an extended range of heat dissipation.[0003]2. Description of Prior Art[0004]With the rapid progress of technology industry, the functions of electronic devices are more and more powerful; for example, the operational speeds of the electronic components in the central processing unit (CUP), chip set, and display unit increase accordingly. As a result, the heat generated per unit time by the electronic components is getting higher. Therefore, if the heat generated can not be dissipated promptly, it will affect the effective operation of the electronic device or cause damage to the electronic components.[0005]The general heat dissipating devices used for the electronic components to remove heat in industry are mainly the heat dissipating components such as fans, heat sinks and heat pi...

AI Technical Summary

Benefits of technology

The present invention provides a heat dissipating device with remote heat dissipation and an extended range of heat dissipation. It has a first body with a first chamber and a first wick structure, a second body with a second chamber and a second wick structure, and a working fluid filled in both chambers. When the first body is heated, the liquid working fluid vaporizes and flows between the chambers due to the communication structure, achieving the effect of remote heat dissipation. This design increases heat dissipation efficiency and provides an improved cooling performance.

Problems solved by technology

Therefore, if the heat generated can not be dissipated promptly, it will affect the effective operation of the electronic device or cause damage to the electronic components.

However, the heat dissipation feature of the traditional vapor chamber only works on the heat generated on or around the place the electronic component is attached to the traditional vapor chamber.

Images