Random coded integrated circuit structures and methods of making random coded integrated circuit structures

a technology of integrated circuits and integrated circuits, applied in the field of physical unclonable functions, can solve the problems of relative hard characterization, practically impossible to duplicate, and resource-intensive structures to incorporate into integrated circuits

Inactive Publication Date: 2014-07-24
IBM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Physically unclonable functions (PUFs) are functions that are embodied in a physical structure that is relatively easy to evaluate but is relatively hard to characterize and practically impossible to duplicate.
However, such structures are currently resource intensive to incorporate into integrated circuits.

Method used

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  • Random coded integrated circuit structures and methods of making random coded integrated circuit structures
  • Random coded integrated circuit structures and methods of making random coded integrated circuit structures
  • Random coded integrated circuit structures and methods of making random coded integrated circuit structures

Examples

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Embodiment Construction

[0017]An array is defined a matrix of n rows and c columns, where n and r are independently positive integers greater than zero and wherein both r and c are not equal to 1.

[0018]A contact is defined an integrated circuit structure comprising a trench in a dielectric layer filled with an electrically conductive material, where the contact physically and electrically connects elements of a device of the integrated circuit to an electrically conductive wire formed in an interlevel dielectric layer formed directly on the dielectric layer.

[0019]A via is defined as an integrated circuit structure comprising a trench in a dielectric layer filled with an electrically conductive material, where the via physically and electrically connects an electrically conductive lower wire formed in a lower interlevel dielectric layer to an electrically conductive upper wire formed in an upper dielectric layer. The lower wire and upper wire may be damascene structures. The dielectric layer and the higher ...

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Abstract

Randomized coded arrays and methods of forming a randomized coded array. The methods include: forming a dielectric layer on a semiconductor substrate; forming an array of openings extending through the dielectric layer; introducing particles into a random set of less than all of the openings; and forming a conductive material in each opening of the array of openings, thereby creating the randomized coded array, wherein a first resistance of a pathway through the conductive material in openings containing the particles is different from a second resistance of a path through openings not containing the particles. Also, a physically unclonable function embodied in a circuit.

Description

TECHNICAL FIELD[0001]The present invention relates to the field of physically unclonable functions; more specifically, it relates to random coded integrated circuit structures and methods of making random coded integrated circuit structures.BACKGROUND[0002]Physically unclonable functions (PUFs) are functions that are embodied in a physical structure that is relatively easy to evaluate but is relatively hard to characterize and practically impossible to duplicate. However, such structures are currently resource intensive to incorporate into integrated circuits. Accordingly, there exists a need in the art to mitigate the deficiencies and limitations described hereinabove.BRIEF SUMMARY[0003]A first aspect of the present invention is a method of forming a randomized coded array, comprising: forming a dielectric layer on a semiconductor substrate; forming an array of openings extending through the dielectric layer; introducing particles into a random set of less than all of the openings;...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L21/02H01L23/538
CPCH01L23/5384H01L21/02697G09C1/00H01L21/76816H01L21/76877H01L23/485H01L23/5226H01L23/576H01L2924/0002H04L9/0866H04L9/3278H04L2209/12
Inventor SONG, YUNSHENGWONG, KEITH KWONG HONXIN, YONGCHUNYANG, ZHIJIAN
Owner IBM CORP
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