Heat-curable silicone rubber composition
a technology of silicone rubber and composition, applied in the field of heat-curable silicone rubber composition, can solve the problems of inability to exhibit sufficient anti-static effects, difficult to use the composition as a cover for portable music players, portable game machines, cell phones and controllers, etc., and achieves poor compatibility, high anti-static properties, and imparts stably anti-static properties
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example 1
[0031]30 parts of dry silica (manufactured by Nippon Aerosil Co., Ltd.) having a specific surface area of 150 m2 / g, and 3 parts of polydimethylsiloxane (average degree of polymerization: 10) having terminal silanol groups were mixed with 100 parts of a vinyl group-containing polydimethylorganosiloxane having an average degree of polymerization of 5000, and having 0.20% by mole of methylvinylsiloxane units, and the mixture was heat-mixed over two hours at 150° C. to thereby obtain a silicone rubber base compound. Next, 10 ppm of N-butyl-3-methylpyridinium•bis(trifluoromethane-sulfonyl)imide, which was water-insoluble, had a decomposition temperature of 290° C., and was liquid at ordinary temperatures, and 0.02 part of dry silica (manufactured by Nippon Aerosil Co., Ltd.) having a specific surface area of 150 m2 / g were added to 100 parts of the base compound, which was carried by the filler and was then mixed. After that, 1.0 part of a vulcanizing agent (TC-8 in which 2,5-dimethyl-2,5...
example 2
[0032]A rubber sheet was obtained in the same manner as in Example 1, except that 1-butyl-1-methylpyrrolidinium•bis-(trifluoro-methanesulfonyl)imide, which was water-insoluble, had a decomposition temperature of 420° C. and was liquid at ordinary temperatures, was used instead of N-butyl-3-methylpyridinium•bis(trifluoromethanesulfonyl)imide.
example 3
[0033]A rubber sheet was obtained in the same manner as in Example 1, except that diallyldimethylammonium•bis(trifluoromethane-sulfonyl)imide, which was poorly water-soluble, had a decomposition temperature of 270° C. and was liquid at ordinary temperatures, was used instead of N-butyl-3-methylpyridinium•bis(trifluoromethane-sulfonyl)imide.
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Abstract
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