High power leds

Abstract

LED chips and packages are disclosed having lenses made of materials that resist degradation at higher operation temperatures and humidity, and methods of fabricating the same. The lenses can be made of certain materials that can withstand high temperatures and high humidity, with the lenses mounted to the LED prior to certain critical metallization steps. This helps avoid damage to the metalized part that might occur as a result of the high mounting or bonding temperature for the lens. One embodiment of an LED chip comprises a flip-chip LED and a lens mounted to the topmost surface of the flip-chip LED. Lenses can be bonded to LEDs at the wafer level or at the chip level. Some of the LED chips and packages can have lenses of different materials with planar and / or curved surfaces.

Description

[0001]This application is a continuation of and claims the benefit of U.S. patent application Ser. No. 12 / 970,789, filed on Dec. 16, 2010.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]This invention relates to light emitting diodes (LEDs) and in particular to LED chips or packages.[0004]2. Description of the Related Art[0005]Light emitting diodes (LED or LEDs) are solid state devices that convert electric energy to light, and generally comprise one or more active layers of semiconductor material sandwiched between oppositely doped layers. When a bias is applied across the doped layers, holes and electrons are injected into the active layer where they recombine to generate light. Light is emitted from the active layer and from all surfaces of the LED.[0006]In order to use an LED chip in a circuit or other like arrangements, it is known to enclose an LED chip in a package to provide environmental and / or mechanical protection, color selection, light extraction, light ...

AI Technical Summary

Benefits of technology

The present invention is about LED chips and packages that have lenses made of materials that can resist damage from high temperatures and humidity. These lenses can be attached to the LED before certain steps, which helps prevent damage to the metal part that helps bond the lens to the LED. The LED chips and packages can have different arrangements of lenses made of different materials with both planar and curved surfaces. The technical effect of this invention is that it provides LED chips and packages that have better resistance to damage from environmental factors and higher temperatures, which can improve their reliability and performance.

Problems solved by technology

However, high temperatures from the highly driven LEDs can spread to the lens, causing the lens heat-up.

This can cause the polymer material of the lenses to degrade more quickly than would typically occur with operation under lower temperatures, and this degradation can result in certain undesirable effects for the LED package.

In some cases the lens can become discolored or browned or even cracked, which can significantly reduce the transparency of the lens and can result in absorption of LED light passing through the lens.

This in turn can reduce the overall emission efficiency of the package.

This discoloration can also result in a shift in the color of light emitted by the package.

It is not, however, practical to form these over conventional LEDs in the same way that polymer lenses are formed.

Molding non-polymer lenses on an LED chip can present certain manufacturing challenges.

These crystalline non-polymer lenses could be formed separately and then mounted over an LED with a polymer material such as a silicone or epoxy, but this presents the same potential problem of having a polymer material that can degrade when under elevated temperatures.

The elevated temperatures can damage metalized components of the LED such as the contacts, wire bonds, reflectors, etc.

The most severe damage is to the metal-to-semiconductor contact.

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