Low-temperature sealing glass frit and method for preparing composite filler in glass frit

Abstract

The invention discloses a lower-temperature sealing glass frit and a method for preparing a composite filler in the glass frit. The lower-temperature sealing glass frit includes a glass powder and a negative thermal expansion composite filler with an adjustable thermal expansion coefficient. The thermal expansion coefficient of the low-temperature sealing glass frit into which the composite material and the glass powder is mixed can be adjustable so that the thermal expansion coefficient of the low-temperature sealing glass frit can match the thermal expansion coefficient of glass substrates packaging an OLED device to thereby improve the yield of the packaged OLED device.

Description

CROSS-REFERENCES TO RELATED APPLICATIONS[0001]This application claims the benefit of priority to Chinese Patent Application No. 201410838765.2, filed with the Chinese Patent Office on Dec. 26, 2014 and entitled “LOW-TEMPERATURE SEALING GLASS FRIT AND METHOD FOR PREPARING COMPOSITE FILLER IN GLASS FRIT”, the content of which is incorporated herein by reference in its entirety.BACKGROUND OF THE INVENTION[0002]In a process of fabricating an OLED display panel, in order to ensure the lifetime of an OLED device, an organic layer in the OLED device is typically insulated from vapor and oxygen in ambient air, and in the related art, an area to be sealed enclosed by an upper sealing glass substrate and a lower sealing glass substrate for packaging the OLED device is filled with a sealing glass frit (see FIG. 1), and then the sealing glass frit is heated by a moving laser beam and melted to make the OLED device airtight, where the sealing glass frit is typically a low-temperature sealing gla...

AI Technical Summary

Benefits of technology

[0008]The low-temperature sealing glass frit above, or the composite material prepared in the method above, according to the embodiments of the invention can be used as a negative thermal expansion composite filler with an adjustable thermal expansion coefficient, and the thermal expansion coefficient of the low-temperature sealing glass frit mixed into which the composite filler and the glass powder is mixed can be adjustable, so that the thermal expansion coefficient of the low-temperature sealing glass frit can match with the thermal expansion coefficient of glass substrates packaging an OLED device to thereby improve the yield of the packaged OLED device.

Problems solved by technology

If the thermal expansion coefficient of the sealing glass frit is significantly different from the thermal expansion coefficient of the sealing glass substrates, then warping and breakage may occur when the sealing glass substrates are sealed by the sealing glass frit, or breakage may occur in the sealing glass substrates packaging the OLED device being illuminated by intensive light, thus resulting in a low yield of the packaged OLED device.

However it may be difficult to control the thermal expansion coefficient of the sealing glass frit into which such a filler and the glass powder is mixed, and micro-breakage may tend to occur at the sites where the OLED device is packaged by the sealing glass frit including the filler, thus degrading the strength of the sealing material as a whole.

Consequently, it may be difficult to control the thermal expansion coefficient of the sealing glass frit in the related art because the filler is a negative thermal expansion material, which may degrade the yield of the packaged OLED device.

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