Optical bench subassembly having integrated photonic device
Inactive Publication Date: 2016-09-22
SENKO ADVANCED COMPONENTS
View PDF4 Cites 17 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Benefits of technology
[0024]The present invention provides an improved structure to facilitate optical alignment of photonic device to an optical bench, which overcomes the drawbacks of the prior art. The present invention combines
Problems solved by technology
This is challenging especially for multiple fiber applications, where multiple optical fibers need to be optically aligned to multiple optoelectronic devices using an active optical alignment approach in which the position and orientation of the optical fiber(s) is adjusted by machinery until the amount of light transferred between the fiber and optoelectronic is maximized.
Active optical alignment involves relatively complex, low throughput processes since the VCSEL or PD must be energized during the active alignment process.
Manufacturers of integrated circuits often have expensive capital equipment capable of sub-micron alignment (e.g. wafer probers and handlers for testing integrated circuits), whereas companies that package chips generally have less capable machinery (typically several micron alignment tolerances which is not adequate for single-mode devices) and often use manual operations.
The current state of the art is expensive due to the inclusion of a package, excludes the use of common electronics and assembly processes, and/or often not suited to single-mode applications.
The package is a relatively more expensive assembly (which includes expensive circuit components, such as ICs, etc.) as compared to the hermetic f
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0040]This invention is described below in reference to various embodiments with reference to the figures. While this invention is described in terms of the best mode for achieving this invention's objectives, it will be appreciated by those skilled in the art that variations may be accomplished in view of these teachings without deviating from the spirit or scope of the invention.
[0041]The present invention provides an improved structure to facilitate optical alignment of photonic device to an optical bench, which overcomes the drawbacks of the prior art. The present invention combines a photonic device with an optical bench in a subassembly, so that alignment of the optical coupling of the photonic device with the optical bench can be performed outside of the optoelectronic package assembly.
[0042]In accordance with the present invention, the photonic device is attached to a base of the optical bench, with its optical input / output in optical alignment with the optical output / input ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
PUM
Property
Measurement
Unit
Optical properties
aaaaa
aaaaa
Login to view more
Abstract
An optical bench subassembly including an integrated photonic device. Optical alignment of the photonic device with the optical bench can be performed outside of an optoelectronic package assembly before attaching thereto. The photonic device is attached to a base of the optical bench, with its optical input/output in optical alignment with the optical output/input of the optical bench. The optical bench supports an array of optical fibers in precise relationship to a structured reflective surface. The photonic device is mounted on a submount to be attached to the optical bench. The photonic device may be actively or passively aligned with the optical bench. After achieving optical alignment, the submount of the photonic device is fixedly attached to the base of the optical bench. The optical bench subassembly may be structured to be hermetically sealed as a hermetic feedthrough, to be hermetically attached to a hermetic optoelectronic package.
Description
PRIORITY CLAIM[0001]This application:[0002](1) claims the priority of U.S. Provisional Patent Application No. 62 / 136,601 filed on Mar. 22, 2015;[0003](2) is a continuation-in-part of U.S. patent application Ser. No. 13 / 861,273 filed on Apr. 11, 2013, which:[0004](a) claims the priority of U.S. Provisional Patent Application No. 61 / 623,027 filed on Apr. 11, 2012,[0005](b) claims the priority of U.S. Provisional Patent Application No. 61 / 699,125 filed on Sep. 10, 2012, and[0006](c) is a continuation-in-part of U.S. patent application Ser. No. 13 / 786,448 filed on Mar. 5, 2013, which claims the priority of U.S. Provisional Patent Application No. 61 / 606,885 filed on Mar. 5, 2012;[0007](3) is a continuation-in-part of U.S. patent application Ser. No. 14 / 714,211 filed on May 15, 2015, which[0008](a) claims the priority of U.S. Provisional Patent Application No. 61 / 994,094 filed on May 15, 2014, and[0009](b) is a continuation-in-part of U.S. patent application Ser. No. 14 / 695,008 filed on A...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.