Optical fingerprint sensor module and package thereof

Abstract

The present invention provides an optical fingerprint sensor module and its package thereof, which comprises a carrier, at least one light emitting diode, at least one image sensor and a molding compound. When a user's fingerprint is generated for recognition, the light emitting diode provides enough light sources for lighting and helping the image sensor to capture and sense an image of the fingerprint. A top emitting surface of the light emitting diode is higher than a top of the image sensor, such that interferences from the side light of the light emitting diode with the image sensor can be effectively avoided. Besides, the molding compound comprises a caved portion corresponding to the image sensor on a vertical plane. By designing above, it successfully achieves the purpose of reducing a thickness of the optical fingerprint sensor package.

Description

REFERENCE TO RELATED APPLICATION[0001]This patent application is based on U.S. Provisional Patent Application Ser. No. 62 / 425,715, filed 23 Nov. 2016.BACKGROUND OF THE INVENTIONField of the Invention[0002]The present invention relates to an optical package structure, and more particularly to an optical fingerprint sensor module and its package thereof.Description of the Prior Art[0003]Fingerprint recognition has been widely utilized in a variety of technical fields, especially in those fields when security verifications are needy. For example, portable communication devices (i.e. mobile phone, a tablet PC), financial transactions, home-based security and so on, all demand sophisticated fingerprint recognition apparatuses, and therefore making the fingerprint recognition apparatus an unique and standard manner of a person's distinctive identity verification.[0004]When speaking of mechanisms of fingerprint recognition technology, as far as we know, there are mainly two types of finger...

AI Technical Summary

Benefits of technology

The present invention provides an optical fingerprint sensor module with improved accuracy and precision. This is achieved by using a carrier, at least one light emitting diode, and at least one image sensor, where the light emitting diode is placed higher than the image sensor to avoid interference from side light. The module can also include a protruding part or a lead frame to further enhance the accuracy. The resulting package is thinner and less expensive while maintaining the same sensing accuracy.

Problems solved by technology

However, since the structure of the semiconductor type is usually much more complicated and requires high complexity when being manufactured, the optical type is advantageous and profitable instead.

However, it should be noticed that problems arise when the at least one light source are usually designed to surround the image sensor on a horizontal plane.

And because of that, the side light of the at least one light source will produce various interferences with the image sensor, thereby affecting the accuracy and precision of the sensing and recognition results.

Besides, since the optical fingerprint apparatus is usually composed of an optical QFN (Quad-Flat-No-Lead) package therein, thickness of the optical package is also very critical.

Nevertheless, it is believed that so far those achievements are still limited and cannot be utilized extensively.

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