Semiconductor device and method of forming the same

Abstract

The present invention relates to a semiconductor device and a method of forming the same, the semiconductor device includes a substrate, a gate structure, an insulating stacked structure and a first conductive layer. The gate structure is disposed on the substrate, and the insulating stacked structure covers the gate structure and the substrate to define a first opening thereinto expose a portion of the gate structure and a portion of the substrate. The first conductive layer covers surfaces of the first opening to directly in contact with the portion of the substrate and the portion of the gate structure, with the first conductive layer including two outer extension wings on a top surface of the insulating stacked structure.

Description

BACKGROUND OF THE INVENTION1. Field of the Invention[0001]The present invention relates generally to a semiconductor device and a method of forming the same and more particularly, to a semiconductor device having a pre-plug conductive layer to configure as a portion of the interconnection system thereof, and a method of forming the same.2. Description of the Prior Art[0002]Semiconductor integrated circuits are one of the most important hardware bases in the modern information society. A key design point of the semiconductor industry is to increase integration of integrated circuits, and therefore to use the area of integrated circuits more efficiently. Generally speaking, integrated circuits having complex functions are made up of many standard cells, each with basic functions. However, it is found that valuable areas in the elements with cells of multi-heights are always wasted and complexities of circuit design and manufacturing processes are both increased. Therefore, an integrat...

AI Technical Summary

Benefits of technology

The present invention provides a semiconductor device with a pre-plug conductive layer that serves as the primary interconnection system, which helps to effectively shrink the device layout. This allows for a more reliable semiconductor device to be formed under a smaller cell size. The present invention also improves the plug forming process under this semiconductor device with a shrunk layout, avoiding possible impacts on the process window and ensuring plugs with a preferable structure for better reliability.

Problems solved by technology

However, it is found that valuable areas in the elements with cells of multi-heights are always wasted and complexities of circuit design and manufacturing processes are both increased.

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