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Thin-film piezoelectric-material element with protective film composition and insulating film through hole exposing lower electrode film

a piezoelectric material, thin film technology, applied in the direction of piezoelectric/electrostrictive/magnetostrictive devices, arm assemblies, integrated arm assemblies, etc., can solve the problem of failure of hga sometimes

Active Publication Date: 2020-03-19
SAE MAGNETICS (HK) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention is about a thin-film piezoelectric-material element used in hard disk drives. The invention aims to maintain the performance of the thin-film piezoelectric-material element even when helium gas is filled up into the housing or enclosure of the hard disk drive. The invention includes a laminated structure part, a lower piezoelectric-material protective-film, an upper piezoelectric-material protective-film, a surface layer insulating film, and a lower electrode pad. The lower piezoelectric-material protective-film and the upper piezoelectric-material protective-film are formed with alloy material including Fe as main ingredient and having Co and Mo. The invention helps to prevent deterioration of the piezoelectric-material element and maintain its performance even during the filling up of helium gas.

Problems solved by technology

However, in the conventional hard disk drive, helium gas is filled up into the housing or enclosure, thereby a failure in the HGA sometimes occurs.

Method used

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  • Thin-film piezoelectric-material element with protective film composition and insulating film through hole exposing lower electrode film
  • Thin-film piezoelectric-material element with protective film composition and insulating film through hole exposing lower electrode film
  • Thin-film piezoelectric-material element with protective film composition and insulating film through hole exposing lower electrode film

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Embodiment Construction

[0039]In the following, embodiments of the present invention will be described with reference to the drawings. Note that the same components will be referred to with the same numerals or letters, while omitting their overlapping descriptions.

Structure of HGA

[0040]To begin with, a structure of the HGA according to the embodiment of the present invention will be explained with reference to FIG. 1 to FIG. 4. Here, FIG. 1 is a perspective view showing a whole of the HGA 91, from front side, according to an embodiment of the present invention. FIG. 2 is a perspective view showing a principal part of the HGA 91 from front side. FIG. 3 is a perspective view showing a principal part of the suspension 50 constituting the HGA 91 from front side. Further, FIG. 4 is a perspective view showing a part, which a thin-film piezoelectric-material element 12b is fixed, of a flexure 6 with enlargement.

[0041]As illustrated in FIG. 1, the HGA 91 has the suspension 50 and a head slider 60. The suspension ...

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Abstract

A thin-film piezoelectric-material element includes a laminated structure part having a lower electrode film, a piezoelectric-material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric-material film, a lower piezoelectric-material protective-film being formed with alloy material, and an upper piezoelectric-material protective-film being formed with alloy material. The lower piezoelectric-material protective-film and the upper piezoelectric-material protective-film are formed respectively in the lower side of the lower electrode film and the upper side of the upper electrode film, of the laminated structure part, so as to sandwich the laminated structure part. The lower piezoelectric-material protective-film, and the upper piezoelectric-material protective-film are formed with alloy material including Fe as main ingredient and having Co and Mo, by Ion beam deposition.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a continuation-in-part application of application Ser. No. 16 / 136,227, filed Sep. 19, 2018, the entire contents of which is hereby incorporated herein by reference.BACKGROUNDField of the Invention[0002]The present invention relates to a thin-film piezoelectric-material element which has a piezoelectric-material and electrodes having thin-film like shape, method of manufacturing the thin-film piezoelectric-material element, head gimbal assembly and hard disk drive having the thin-film piezoelectric-material element.Related Background Art[0003]A hard disk drive has a large recording capacity and is used as the heart of a storage device. The hard disk drive records and reproduces data to / from a hard disk (recording medium) by a thin-film magnetic head. A part, which the thin-film magnetic head is formed, is called as a head slider, and a part, which the head slider is mounted on the edge part, is a head gimbal assembly (w...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L41/08H01L41/047H01L41/053H01L41/09H01L41/083H01L41/27H01L41/29H01L41/316G11B5/48H10N30/00H10N30/05H10N30/06H10N30/076H10N30/20H10N30/50H10N30/853H10N30/87H10N30/88
CPCG11B5/483H01L41/083H01L41/0815H01L41/1871H01L41/29H01L41/316H01L41/09H01L41/27H01L41/0477H01L41/1876H01L41/0533G11B5/484G11B5/4833H10N30/877H10N30/883H10N30/206H10N30/06H10N30/076H10N30/082H10N30/708H10N30/05H10N30/20H10N30/50H10N30/8536H10N30/8554
Inventor XIONG, WEIIIJIMA, ATSUSHI
Owner SAE MAGNETICS (HK) LTD