Unlock instant, AI-driven research and patent intelligence for your innovation.

A chip testing method and an apparatus for testing of a plurality of field emission light sources

a field emission light source and testing method technology, applied in the direction of lamps testing, electric lighting sources, instruments, etc., can solve the problems of occupying further space, occupying a significant part of the cost of manufacturing, and occupying a significant amount of the cost of both purchase and maintenance, so as to save cost and space in the end user application, reduce mechanical stress, and ensure the effect of quality

Active Publication Date: 2020-07-23
PUREFIZE TECH AB +1
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides an improved operating procedure for testing multiple field emission light sources without wasting expensive wafer real state for individual electrical interface points. Rather, a single control signal may be used for testing the light sources, and the number of electrical interface points may be reduced to one per each of the columns and rows in which the light sources are arranged. This is particularly useful when using a common wafer substrate or anode substrate for the light sources. This approach also reduces mechanical stress and avoids the use of through-hole electrical connection. Additionally, a common anode structure or individual anode structure may be used for different light sources in the field emission device.

Problems solved by technology

Therefore, quality control and test for multiple products is a significant issue, and thus forming a significant part of the cost for manufacturing.
Such equipment is commonly available, but of course at a significant cost in both purchase and maintenance.
Further common issues with this method are misalignment of probes, wear of probes, eventually causing contact problems.
This will obviously require an electrical connection to each individual device and the individual devices must be separated by some distance for practical reasons, thus occupying further space.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A chip testing method and an apparatus for testing of a plurality of field emission light sources
  • A chip testing method and an apparatus for testing of a plurality of field emission light sources
  • A chip testing method and an apparatus for testing of a plurality of field emission light sources

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029]The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which currently preferred embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided for thoroughness and completeness, and fully convey the scope of the invention to the skilled addressee. Like reference characters refer to like elements throughout.

[0030]Referring now to the drawings and to FIG. 1 in particular, there is illustrated a typical process flow 100 for wafer test, sawing / dicing, encapsulation and final test in order to put the invention into context. Once the manufacturing of a wafer containing multiple field emission light sources (FELs) has been completed, the wafer is to be tested, for example by a test system 102, and the parametric data such as for example operating voltage, current, power...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
voltageaaaaaaaaaa
distanceaaaaaaaaaa
widthaaaaaaaaaa
Login to View More

Abstract

The present invention generally relates to a method for operating a plurality of field emission light sources, specifically for performing a testing procedure in relation to a plurality of field emission light sources manufactured in a chip based fashion. The invention also relates to a corresponding testing system.

Description

TECHNICAL FIELD[0001]The present invention generally relates to a method for operating a plurality of field emission light sources, specifically for performing a testing procedure in relation to a plurality of field emission light sources manufactured in a chip based fashion. The invention also relates to a corresponding testing system.BACKGROUND OF THE INVENTION[0002]The technology used in modern energy saving lighting devices uses mercury as one of the active components. As mercury harms the environment, extensive research is done to overcome the complicated technical difficulties associated with energy saving, mercury-free lighting.[0003]An approach used for solving this problem is to use field emission light source technology. Field emission is a phenomenon which occurs when a very high electric field is applied to the surface of a conducting material. This field will give electrons enough energy such that the electrons are emitted (into vacuum) from the material.[0004]In prior ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): H05B41/392G01R31/44H01J63/02
CPCH01J63/02H05B41/3922G01R31/44G01R31/24G01R31/2844H01J9/42H01J63/04H01J63/06
Inventor TIRÉN, JONASDEMIR, HILMI VOLKANSHARMA, VIJAY KUMARTAN, SWEE TIAM
Owner PUREFIZE TECH AB