Substrate and method for monitoring positions of boundaries of film layer on the substrate
a technology of substrate and film layer, which is applied in the direction of semiconductor devices, semiconductor/solid-state device details, instruments, etc., can solve the problems of reducing production efficiency, wasting a lot of debugging time, and reducing the accuracy of confirming the boundaries of film layers at the edges of display regions, so as to improve the accuracy of confirming the boundaries of film layers, shorten the start-up time, and increase production capacity
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[0039]The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of the present invention.
[0040]In the description of the present invention, it is to be understood that the terms “center,”“longitudinal,”“lateral,”“length,”“width,”“thickness,”“upper,”“lower,”“front,”“rear,”“left,”“right,”“vertical,”“horizontal,”“top,”“bottom,”“inner,”“outer,”“clockwise,”“counterclockwise,” and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present invention and for s...
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