Process for physical isolation of regions of a substrate board

Abstract

Process for physical isolation of regions (110) of a substrate board (100) comprising the following steps:a) formation of trenches (106) in the substrate, delimiting regions of the substrate (110),b) placement of a liquid bonding material (120) in the trenches, which can solidify and bond to the substrate board (100) when in the solid state,c) solidification of the bonding material.Application to isolation of electronic, optical, mechanical or magnetic components.

Description

TECHNICAL DOMAINThis invention relates to a process for preparation of a substrate board, and more precisely for the physical isolation of regions of a substrate board.For the purposes of the invention, physical isolation of regions means a separation between the various regions to electrically and / or optically and / or magnetically and / or mechanically (particularly piezoelectrically) isolate the said regions.The invention may be used in a very wide variety of applications in industry, depending on the isolation type planned.For example, a semiconductor substrate board with electrically isolated regions may be used to make electronic components, and particularly power switching components.In the same way, a substrate board comprising regions of transparent of double refraction material may be used for making wave guides, lenses or optical switches. Similarly, a substrate board comprising regions of piezoelectric or electro-optic materials may be used to make sensor or actuator matrice...

AI Technical Summary

Benefits of technology

The support used in step a) efficiently maintains the cohesion of regions of the substrate board until the placement and solidification of the bonding material.

Problems solved by technology

Special measures taken to provide sufficient electrical isolation between components makes modifications necessary to the form of components, and frequently complex preparations of integration supports.

Furthermore, isolation constraints are frequently contrary to the requirements of an increasingly dense integration.

Isolation of more traditional electronic components formed throughout the thickness of the support substrate also involves complex substrate preparation operations.

Component isolation problems also arise for optical circuits in which it is necessary to avoid any diffusion or propagation of parasite light between the various components.

Finally, complex magnetic or mechanical isolation precautions must be taken for the manufacture of magnetic or mechanical sensors or transducers.

The difficulties mentioned above are even worse when different categories of components are to be integrated on the same substrate board, if the components have different isolation requirements.

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