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Enclosed nanotube structure and method for forming

a nanotube and enclosed technology, applied in the direction of digital storage, diodes, instruments, etc., can solve the problems of device formation on electrical structures that are typically not protected and devices that malfunction

Inactive Publication Date: 2010-08-24
GLOBALFOUNDRIES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The solution effectively protects semiconductor devices from external damage, ensuring the integrity and functionality of the nanotube structures within the device, enabling reliable operation by creating an enclosed environment for the nanotubes.

Problems solved by technology

Devices formed on electrical structures are typically not protected from external elements that may cause the devices to malfunction.

Method used

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  • Enclosed nanotube structure and method for forming
  • Enclosed nanotube structure and method for forming
  • Enclosed nanotube structure and method for forming

Examples

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Embodiment Construction

[0041]FIGS. 1A-1L illustrate and detail stages in a fabrication process of a semiconductor structure 2, in accordance with embodiments of the present invention. The semiconductor structure 2 illustrated in FIGS. 1A-1L is a cross sectional view. The fabrication process described with respect to FIGS. 1A-1L illustrates the formation of a non-volatile electro / mechanical memory structure (e.g., a nanotube random access memory (NRAM) structure) comprising an enclosed nanotube structure 20 within the semiconductor structure 2 (see completed semiconductor structure 2 in FIG. 1L).

[0042]In FIG. 1A, the semiconductor structure 2 is provided for the fabrication process, in accordance with embodiments of the present invention. The semiconductor structure 2 comprises a substrate 5 with a first electrode layer 7 formed over the substrate 5, a second electrode layer 9 formed over the first electrode layer 7, a mandrel layer 11 formed over the second electrode layer 9, and a photo resist layer 14 f...

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PUM

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Abstract

A semiconductor device and associated method for forming. The semiconductor device comprises an electrically conductive nanotube formed over a first electrically conductive member such that a first gap exists between a bottom side the electrically conductive nanotube and a top side of the first electrically conductive member. A second insulating layer is formed over the electrically conductive nanotube. A second gap exists between a top side of the electrically conductive nanotube and a first portion of the second insulating layer. A first via opening and a second via opening each extend through the second insulating layer and into the second gap.

Description

BACKGROUND OF THE INVENTION[0001]1. Technical Field[0002]The present invention relates to a semiconductor device comprising an enclosed nanotube structure.[0003]2. Related Art[0004]Devices formed on electrical structures are typically not protected from external elements that may cause the devices to malfunction. Thus, there is a need for a structure and associated method for protecting devices formed on electrical structures from external elements.SUMMARY OF THE INVENTION[0005]The present invention provides a semiconductor device, comprising:[0006]a substrate;[0007]a first electrically conductive member formed on a first portion of said substrate;[0008]a first insulating layer formed on a second portion of said substrate;[0009]an electrically conductive nanotube formed over said first insulating layer and over said first electrically conductive member such that a first gap exists between a bottom side of said electrically conductive nanotube and a top side of said first electricall...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H01L21/82
CPCB82Y10/00H01L51/0554G11C13/025H01L21/7682H01L29/0665H01L29/685H01L29/86H01L51/0048H01L2221/1094H10K85/221H10K10/482
Inventor GAMBINO, JEFFREY PETERNGUYEN, SON VAN
Owner GLOBALFOUNDRIES INC