Patch package structure

Abstract

The present invention relates to a patch package structure which includes: a package including a first sheet material and a second sheet material, the first and second sheet materials being sealed together in peripheral parts thereof; and a patch disposed in the package, the patch contains a backing, a pressure-sensitive adhesive layer laminated on at least one side of the backing, and a release liner which protects a pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer, the release liner having on a surface thereof a cut line supporting a peel-off of the release liner at the time of using the patch, the patch being disposed in the package so that the release liner faces the inner surface of the first sheet material, the first sheet material having a first region in which the inner surface of the first sheet material faces the cut line of the release liner, the first sheet material having in the first region a minimum first distance between the inner surface of the first sheet material and the surface of the release liner, and the inner surface of the first sheet material being spaced from the surface of the release liner at the minimum first distance in the first region.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a patch package structure which includes: a package including a first sheet material and a second sheet material, the first and second sheet materials being sealed together in peripheral parts thereof; and a patch disposed in the package.BACKGROUND OF THE INVENTION[0002]Patches to be applied to the skin for the purpose of, e.g., protecting the affected part and adhesive preparations to be applied to a surface of the skin of a mammal for the purpose of percutaneously administering a drug to the mammal have hitherto been developed.[0003]Such a patch generally includes a backing, a pressure-sensitive adhesive layer laminated on at least one side of the backing, and a release liner which protects the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer. When such a patch is used, the release liner is peeled off and removed. In some patches, the release liner has a cut line in a surface thereof so as to ...

AI Technical Summary

Benefits of technology

[0010]The present inventors have made intensive studies. As a result, it has been found that, by molding a sheet material facing a cut line of a release liner of a patch into a given shape, even if components of the pressure-sensitive adhesive layer protrude from or flow out through the cut line, the components of the pressure-sensitive adhesive layer can be inhibited from adhering to the sheet material, whereby the patch can be easily taken out of the package. The inventors have further found a new effect that, in this package structure, load imposition on the vicinity of the cut line of the patch is avoided and the protrusion or outflow of components of the pressure-sensitive adhesive layer is also inhibited unexpectedly. The invention has been thus completed based on these findings. Accordingly, the invention provides the following (1) to (8).

[0024]In the patch package structure of the invention, the patch is disposed in the package so that the release liner faces the inner surface of the first sheet material. The first sheet material has a first region in which the inner surface of the first sheet material faces the cut line of the release liner. In the first region, the inner surface of the first sheet material and the surface of the release liner of the patch disposed in the package provide a minimum first distance between them. Since the inner surface of the first sheet material and the cut line formed on a surface of the release liner are spaced from each other at the minimum first distance, they are less apt to come into contact with each other. Accordingly, even if components of the pressure-sensitive adhesive layer protrude from or flow out through the cut line, the components of the pressure-sensitive adhesive layer are less apt to adhere to the inner surface of the package containing the patch. Consequently, the patch can be easily taken out of the package.

[0025]Furthermore, unexpectedly, since the inner surface of the first sheet material in the patch package structure of the invention is less apt to come into contact with the cut line on a surface of the release liner, a part of the patch which is near to the cut line are less apt to receive a load from outside the package structure through the package. Consequently, the patch package structure attains a new effect that the protrusion or outflow of the components of the pressure-sensitive adhesive layer from the cut line is inhibited. As a result, the possibility that the components of the pressure-sensitive adhesive layer might adhere to the hand of the user at the time of use to give an uncomfortable feeling is significantly diminished.

[0026]Accordingly, the patch package structure of the invention therefore has advantages that the components of the pressure-sensitive adhesive layer are less apt to protrude from or flow out through the cut line on a surface of the release liner and that the user is less apt to feel uncomfortable, e.g., to come to have a sticky hand. Further, even if components of the pressure-sensitive adhesive layer protrude or flow out, the components of the pressure-sensitive adhesive layer are less apt to adhere to the inner surface of the package and the patch can be easily taken out of the package. Therefore, according to the patch package structure of the invention, the patch can be used extremely comfortably.

Problems solved by technology

However, this patch has such a drawback that components of the pressure-sensitive adhesive layer may protrude from or flow out through the cut line and adhere to inner surfaces of the package in which the patch is placed, whereby it might become difficult to take the patch out of the package or the components of the pressure-sensitive adhesive layer may adhere to the hand of the user to give an uncomfortable feeling.

However, since the cut line 9 of the patch can freely come into contact with the sheet material 14 in this package structure, there is a fear that, when components of the pressure-sensitive adhesive layer protrude from the cut line 9, then the components may adhere to an inner surface of the package to make it difficult to take out the patch or may adhere to the hand of the user to give an uncomfortable feeling.

Furthermore, in these documents, no statement can be found concerning the necessity of inhibiting components of the pressure-sensitive adhesive layer which have protruded from or flowed out through the cut line on a surface of the release liner from adhering to an inner surface of the package.