Earmuff and headphone
a technology of ear splints and ear pads, which is applied in the direction of headwear, sound producing devices, instruments, etc., can solve the problems of inability to increase the size of ear pads over a certain level, the volume of the front air chamber becomes small, and the user's comfort is not affected, so as to improve the insulation against external noise, the effect of preventing the volume of the front air chamber and not reducing the volum
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
Problems solved by technology
Method used
Image
Examples
first embodiment
[0041]An embodiment of an earmuff according to the present invention is described below with reference to some of the drawings. FIG. 1 is a longitudinal sectional view exemplary illustrating an earmuff according to the present invention. In this earmuff 10 illustrated in FIG. 1, a baffle board 12 is fixed at an opening of an ear cup 11, and an ear pad 13 is fixed to the baffle board 12.
[0042]The baffle board 12 has a shape in which two torus-shaped members having an outer diameter different from each other are separated in an axial direction, and are integrally connected.
[0043]A headband 14 made of a flexible member and applies pressing force in the direction towards the ear pad 13 is attached to the ear cup 11 at a position substantially at the center of the outer surface of the ear cup 11. The other end of the headband 14 is attached to another earmuff 10 having the same shape as the above described earmuff 10.
[0044]The ear pad 13 is mainly composed of a torus-shaped cushioning me...
second embodiment
[0058]Another embodiment of an earmuff according to the present invention is described below with reference to FIG. 2. In this earmuff 10a illustrated in FIG. 2, a ribbed wall 17 is provided on the periphery of the front torus-shaped member of the baffle board 12 in the above-described first embodiment. The ribbed wall 17 may be an end portion of the baffle board 12 extended and folded, or be a ring shaped member being adhered to the baffle board 12 and having a certain thickness and an external diameter substantially the same as that of the external diameter of the baffle board 12.
[0059]The height of the ribbed wall 17 is equal to or slightly larger than the thickness of the air-permeable cushioning member 15 (the distance between the baffle board 12 and the ear pad 13). Thus, even if the ear pad 13 is compressed by pressing force applied by the headband 14 while the earmuff 10a is being worn, the air-permeable cushioning member 15 is protected from being compressed by the ribbed w...
third embodiment
[0061]Still another embodiment of an earmuff according to the present invention is described below with reference to FIG. 3. In an earmuff 10b illustrated in FIG. 3, a baffle board 12a is provided with a communication hole 19 that acoustically communicates the front air chamber 16 and a rear air chamber 18. The rear air chamber 18 is an inner space of the ear cup 11. The front air chamber 16 and an air layer of the rear air chamber 18 are communicated through the communication hole 19. Thus, the volumes of both rear air chamber 18 and front air chamber 16 can effectively contribute to the sound insulation property. Accordingly, the insulation against external noise can be further improved.
[0062]The sound insulation property and the acoustic characteristics of the earmuff 10b according to the present embodiment can be controlled by attaching an acoustic resister 20 on the communication hole 19 on the rear air chamber 18 side. The sound insulation property can be improved and at the s...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More - R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com



