Micro-mechanical component with cantilever integrated electrical functional element

a micro-mechanical and functional element technology, applied in the direction of microstructural technology, piezoelectric/electrostrictive device details, sonic/ultrasonic/infrasonic waves, etc., can solve the problem of slow analysis speed, grid scan speed is limited by grid pattern mechanism, and it is difficult to achieve a focus diameter of only a few millimeters

Inactive Publication Date: 2014-08-19
NANOWORLD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The solution enables cantilevers with dimensions as small as a few micrometers in length and width and hundreds of nanometers in thickness, achieving resonant frequencies over 10 MHz, reducing assembly costs and allowing for high-speed scanning without modifying the scanning head, while enabling the integration of multiple sensors and actuators for parallel scanning.

Problems solved by technology

A significant disadvantage of scanning probe microscopy as such is the slow speed of the analysis because the probe scans the surface in a point-by-point grid pattern.
The speed of the grid scan is limited by the grid pattern mechanism, on the one hand, but also by the resonant frequency of the cantilever of the probe.
Especially with the commonly preferred arrangement of a SPM probe moving in a grid pattern above a test sample in fixed position, it is quite difficult to achieve a focus diameter of only a few millimeters.
However, the scaling of this concept for smaller dimensions is often restricted due to the existing structuring processes.
Another disadvantage of known probes with integrated piezoresistive strain sensors is their costly integration in the scanning probe microscope.
The assembly procedures required for this make these probes considerably more expensive.
In addition, a costly modification of the SPM scanning head is required in order to be able to install the assembled probes.
Similar problems are encountered with probes using other integrated sensors, as for example temperature sensors in the form of thermal contact sensors, thermo-resistors.

Method used

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  • Micro-mechanical component with cantilever integrated electrical functional element
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  • Micro-mechanical component with cantilever integrated electrical functional element

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Embodiment Construction

[0029]The FIGS. 1 to 7 each show a micro-mechanical component 100 according to the invention with a micro-mechanical cantilever 1 that is attached to a support element 2 and comprises at least one integrated electrical functional element 3. According to the invention, at least one supply line 41 to the functional element 3 integrated in the micro-mechanical cantilever 1 is provided via a first flat surface 21 of the support element 2 to which the cantilever 1 is attached and via the corresponding first flat surface 21 of the cantilever 1, and at least one additional second supply line 42 (return line) is provided via the opposite second flat surface 22 of the support element 2 and of the cantilever 1. The electrical functional element 3 is arranged on the flat surface 21 of the cantilever 1 that is facing away from the support element 2. At least in the special case of two supply lines 41, 42, this makes it possible for the micro-mechanical component 100 to be electrically contacted...

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Abstract

A micro-mechanical component including a support element and a cantilever with integrated electrical functional element to which at least two electrical supply lines implemented as printed conductors on the cantilever are routed. The invention proposes to arrange at least one each of the supply lines on the two opposite flat surfaces of the cantilever and / or the support element. The functional element is supplied by the first supply line on a first flat surface, with the second supply line on the opposite flat surface serving as return line.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]The present application claims priority under 35 USC §119 to European Patent Application No. 11 401 049.9 filed Mar. 24, 2011, the entire disclosure of which is incorporated herein by reference.TECHNICAL FIELD OF THE INVENTION[0002]The invention relates to a micro-mechanical component having a support element and at least one cantilever, with at least one electrical functional element that is integrated in the cantilever and arranged on a first flat surface of the cantilever, and with at least two electrical supply lines for the functional element that are implemented as printed conductors on the cantilever.DESCRIPTION OF THE RELATED ART[0003]Micro-mechanical components are used, for example, in scanning probe microscopy (SPM). SPM has become established as a surface analysis technology that permits, among other things, the imaging of surface topographies with a resolution of a few nanometers or even down into the nuclear range. An essenti...

Claims

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Application Information

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Patent Type & AuthorityPatents(United States)
IPC IPC(8): G01Q20/04G01Q10/04H02N2/00G01N29/036B82Y35/00B81B7/00G01N29/02H01L41/04H10N30/80
CPCG01Q20/04G01N29/036G01N29/022G01Q10/045B81B7/0006G01N2291/0427B82Y35/00G01N2291/0256
InventorSULZBACH, THOMASENGL, WOLFGANGRICHTER, CHRISTOPH
OwnerNANOWORLD