Memory device having a relatively wide data bus
a memory device and data bus technology, applied in the field of semiconductor memory, can solve the problems of increasing the cost of forming the dram b>10, limiting the speed of operation of the computer system, and complicating the process
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[0019]FIG. 2 is a block diagram of a portion of a DRAM 200 including a wide data path 202 according to one embodiment of the present invention. The wide data path 202 transfers a large block of data accessed in a memory-cell array 204, and may be formed without increasing the size of a semiconductor substrate in which the DRAM 200 is formed, and without requiring the formation of additional conductive layers, as will be explained in more detail below.
[0020]The DRAM 200 includes a memory-cell array 204 formed in an array region 206 of the semiconductor substrate in which the DRAM 200 is formed. The array 204 includes a plurality of memory cells 208 arranged in rows and columns. A plurality of word lines WL1-WLN are formed in a first conductive layer in the array region 206, and are disposed substantially perpendicular to the pairs of digit lines DL1, {overscore (DL1)}-DLN, {overscore (DLN)}. Typically, the first conductive layer is a polysilicon layer formed during fabrication of the...
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