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73results about How to "Raise the voltage difference" patented technology

Pixel drive circuit and driving method thereof, and organic light-emitting display panel

The invention discloses a pixel drive circuit and a driving method thereof, and an organic light-emitting display panel. The pixel drive circuit comprises a light-emitting device, a pixel compensation circuit connected with the light-emitting device, a signal input module, and a leakage suppression module. A reset signal terminal is connected with a control electrode of an initialized transistor by the signal input module. The signal input module is used for providing a signal of the reset signal terminal for the control electrode of the initialized transistor under control of the reset signal terminal; and the leakage suppression module is used for increasing a voltage difference between the control electrode of the initialized transistor and a second electrode of the initialized transistor under control of a leakage control signal terminal. On the basis of mutual cooperation of the modules, the signal inputted into an initialized signal terminal by the initialized transistor can be controlled; and the initialized transistor enters a cut-off state by increasing the voltage difference between the control electrode and the second electrode of the initialized transistor. Therefore, formation of a leakage current path of the initialized transistor can be avoided; the brightness of the light-emitting device can be improved; and the scintillation phenomenon can be improved.
Owner:BOE TECH GRP CO LTD +1

Splitting grid memory cell and operation method thereof

A splitting grid memory cell and an operation method thereof are disclosed. The memory cell comprises: a semiconductor substrate, a floating grid, a control grid and a selection grid, wherein a first doped region, a second doped region and a third doped region are successively formed on the semiconductor substrate; a first diffusion region and a second diffusion region are formed in the third doped region; the floating grid is formed on the semiconductor substrate between the first diffusion region and the second diffusion region; a first side of the floating grid is overlapped with parts of the first diffusion region; the control grid is formed on the semiconductor substrate between a second side of the floating grid and the second diffusion region; an insulating oxide layer is formed between the control grid and the second side of the floating grid; the selection grid is formed on the semiconductor substrate in the first diffusion region; a doped type of the first doped region is the same with the doped type of the third doped region and is opposite to the doped type of the second doped region. By using the memory cell and the method of the invention, a size of the memory cell can be effectively reduced; a quality of the memory cell can be improved and manufacturing costs can be reduced.
Owner:SHANGHAI HUAHONG GRACE SEMICON MFG CORP

Split gate flash memory and forming method thereof

The invention provides a split gate flash memory and a forming method thereof. The forming method of the split gate flash memory includes that: a first media layer and a floating gate layer are sequentially formed on a substrate; a discrete second media layer is formed on the floating gate layer, and an area where the second media layer is located is a word line area; first side walls are formed around the second media layer, and areas between adjacent first side walls are source electrode line areas; the floating gate layer and the first media layer are etched to the substrate by using the first side walls as masks; source electrode lines are formed on the source electrode line areas; a floating gate and a floating gate media layer are formed by removing the second media layer, and the floating gate layer and the first media layer under the second media layer; a third media layer is formed on a floating gate side wall below the top tip of the floating gate which is adjacent to the word line area; a tunneling media layer is formed to cover the substrate, the third media layer, the floating gate, the first side walls and the surfaces of the source electrode lines; and word lines are formed on the tunneling media layer of the word line area. By using the forming method, erasure performance is improved, voltage applied on the word lines is reduced, and power consumption is saved.
Owner:SHANGHAI HUAHONG GRACE SEMICON MFG CORP

Hardening method of inner surface of cylinder barrel of titanium and titanium alloy hydraulic cylinder

The invention discloses a hardening method for an inner surface of a cylinder barrel of a titanium and titanium alloy hydraulic cylinder. The hardening method comprises the following steps: I, polishing the inner surface of the cylinder barrel of the hydraulic cylinder, then, removing greasy dirt and dehydrating; II, putting the dehydrated cylinder barrel, which is used as a cathode, of the hydraulic cylinder in a double-layer glow ion diffusion metalizing furnace, putting a graphite source electrode in the cylinder barrel of the hydraulic cylinder, in the presence of argon gas, generating glow under the high-voltage electric fields by utilizing an anode and a cathode to perform bombardment activation on the inner surface of the cylinder barrel of the hydraulic cylinder; III, after the bombardment activation is finished, introducing a gas mixture of the argon gas and oxygen gas into the double-layer glow ion diffusion metalizing furnace, generating double-layer glow under the high-voltage electric fields by utilizing the anode and the graphite source electrode as well as the anode and the cathode to perform oxyarburizing on the inner surface of the cylinder barrel of the hydraulic cylinder to obtain a composite membrane layer on the inner surface of the cylinder barrel of the hydraulic cylinder. The composite film layer prepared by the hardening method disclosed by the invention is high in bonding strength and good in wear resistance, and capable of effectively avoiding the titanium and titanium alloy occlusive locking problem.
Owner:西安赛福斯材料防护有限责任公司
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