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Wave-guide integrated on substrate-electronic band gap bandpass filter

A substrate-integrated waveguide and electronic bandgap technology, applied to waveguide devices, waveguides, circuits, etc., can solve the problems of high processing precision, bulky band-pass filter, and expensive processing cost of band-pass filter, and achieve increased Frequency selection characteristics, simple design method, effect of volume reduction

Inactive Publication Date: 2007-08-29
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult for these forms of filters to achieve a very wide relative bandwidth (≥50%). Secondly, these forms of bandpass filters are relatively bulky and difficult to integrate with other microwave and millimeter wave devices. Thirdly, these forms of bandpass filters The filter processing cost is relatively expensive, and the requirements for processing accuracy are relatively high

Method used

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  • Wave-guide integrated on substrate-electronic band gap bandpass filter
  • Wave-guide integrated on substrate-electronic band gap bandpass filter
  • Wave-guide integrated on substrate-electronic band gap bandpass filter

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Embodiment Construction

[0017] A substrate-integrated waveguide-electronic bandgap bandpass filter includes: a dielectric substrate 3 covered with metal patches 21 and 22 as the top surface and the ground on both sides, and a substrate 3 is provided on the dielectric substrate 3. Chip integrated waveguide, the substrate integrated waveguide is composed of at least two rows of metalized through holes 1, the metal patches 21, 22 are connected by the metalized through holes 1, and an electronic band gap structure is provided on the ground of the dielectric substrate 3. The top surface of the dielectric substrate 3 is provided with an input terminal 2 and an output terminal 5 which are respectively connected to the same substrate integrated waveguide. The electronic band gap structure is composed of the same plane compact electronic band gap unit 4 arranged in an array, with at least 1 The in-plane compact electronic bandgap unit is located on the ground in the inner area of ​​the substrate integrated wavegu...

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Abstract

The disclosed filter includes a medium base plate. Metal pasters covered on both sides of the said base plate are as a top surface and floor. Substrate integration wave-guide (SIW) on base plate is setup at the medium base plate, and electronic band gap is setup at floor. Input end and output end are connected to integrated wave-guide on same base plate respectively. Structure of electronic band gap is composed of compact type units of electronic band gap arranged in array in same plane. Advantages are: small size of integrated structure of electronic band gap with SIW in filter, easy to be integrated with other ICs, wide frequency selectivity, simple designing method, and possible to add number of identical unit of structure of electronic band gap to increase frequency selectivity.

Description

Technical field [0001] The invention relates to a substrate integrated waveguide-electronic band gap that can be applied to the design of microwave and millimeter wave circuits, and can also be used in the design of microwave and millimeter wave integrated circuits in highly integrated systems such as system packaging (SOP) and system on chip (SOC). Band pass filter. Background technique [0002] Microwave and millimeter wave bandpass filters have a large number of applications in rapidly developing communication systems. With the rapid development of broadband communication systems, there is an urgent need for filters with very wide passbands. The use of traditional metal ridge waveguide and other structures can form a broadband microwave and millimeter wave bandpass filter. However, these forms of filters are firstly difficult to achieve very wide relative bandwidth (≥50%). Secondly, these forms of bandpass filters are relatively bulky and difficult to integrate with other micr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P1/201H01P3/16
CPCH01P1/2005
Inventor 洪伟郝张成陈继新吴柯
Owner SOUTHEAST UNIV
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