Multichip semiconductor package with chip carrier having down stretched pin

Abstract

A multichip semiconductor packaging unit with downward extended stabilizer chip carrier includes a lead frame with a chip carrier at the center which area and width are smaller than that of the chip,in which, the loaded is composed of a strip support frame and several groups of downward extended stabilizers very small carrier will not block the mold flow and eough space between adjacent stabilizers for mold flow passing through can avoid insufficient filling of resin or void, besides, downward stabilizers can be seen as a prestress structure which grasps the die cavity base firmly after closing, and chips will not stricken by the mold flow.

Description

technical field [0001] The present invention relates to a semiconductor package, in particular to a semiconductor package that uses a chip carrier with a plurality of downwardly extending legs instead of a die pad to carry a semiconductor chip. Background technique [0002] Electronic products are developing toward lightness, thinness, shortness, and miniaturization. Semiconductor devices are developing toward low cost, high performance, and small size. Thin Small Outline Package), SSOP (Shrink Small Outline Package) and TQFP (Thin Quad Flat Package) and other thin packaging products with a thickness of only 1 mm, or even 0.75 mm (such as UTSOP (Ultra Thin Small Outline Package)); It is required to install two or more semiconductor chips in a semiconductor device, by increasing integrated circuit density, memory capacity and processing speed. [0003] US Patent No. 5,527,740 discloses a thin semiconductor device with multiple chips. As shown in accompanying drawing 1, this...

AI Technical Summary

Problems solved by technology

However, as the thickness of the overall package becomes thinner (that is, the height of the cavity of the package mold is reduced), many problems will arise in the upper packaging device 1: first, the thickness of the encapsulant 16 of the aforementioned packaging device 1 increases with the thickness of the cavity 192, 193 The reduced height makes the mechanical strength of the encapsulant relatively weak, and the chips 12, 13, chip holder 102, and the encapsulant 16 attached to the surface of the chip holder 102 will be delaminated in the subsequent manufacturing process due to the difference in thermal expansion coefficient of the three. Phenomenon (Delamination), leading to a decline in the quality of finished products

This kind of design will greatly reduce the gap between the chip holder 102' and the lower mold cavity 193' for the resin mold flow to pass through, and cause the flow rate of the lower mold flow 18' to be significantly slower than that of the upper mold flow 17'. 'Quickly wrapping the chip 13' causes a pressure to press the chip holder 102', causing the die pad to tilt (Die Pad Floating), and then presses the pressure to press the die pad 102', causing the die pad to tilt (Die Pad Floating), which indirectly leads to the die pad floating. Lines 14', 15' are exposed outside the encapsulant 16'

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