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Power module and its connecting method

A power module, connected to technology, applied in cooling/ventilation/heating transformation, semiconductor/solid-state device components, semiconductor devices, etc., can solve problems such as increasing material cost, achieve no increase in cost, prevent deformation, and heat dissipation improved effect

Inactive Publication Date: 2007-10-31
TOYOTA JIDOSHA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, the pre-bending of the heat sink or the power module 101 will increase the cost of materials etc.

Method used

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  • Power module and its connecting method

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] Embodiments of the present invention will be described below in conjunction with the accompanying drawings.

[0040] The power module 1 shown in FIGS. 1 and 2 is constructed such that a substrate (not shown) including a semiconductor device such as an IGBT device is covered by a housing 11 made of synthetic resin or the like, and a heat dissipation plate 12 is attached to the housing 11. bottom of.

[0041] The power module 1 is connected to the inverter housing 3 via the thermal grease 5 . The heat conduction grease 5 attaches the heat dissipation plate 12 of the power module 1 to the inverter housing 3 so as to effectively transfer the heat of the semiconductor devices of the power module 1 to the inverter housing 3 .

[0042] In the above case where the power module 1 is connected to the inverter case 3 via the heat-conducting grease 5, the heat-conducting grease 5 is first effectively coated on the inverter case 3, and then the power module 1 is connected to the in...

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PUM

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Abstract

The present invention relates to a power module and a connecting method thereof. For conventional power module, the material of the power module is bent to convex shape in advance in order to attach the casing connected to the power module to the power module and thereby increasing the cost. Even the power module is bent in advance, the gap between the power module and the casing can also generate by coating heat conducting grease on the casing with uniform thickness. Therefore, for the method that the power module 1 having a mounted heat radiating plate 12 is attached to an inverter case 3 via a heat conducting grease 5, the surface of the heat radiating plate 12 is heated previously to bend the power module 1, the heat radiating plate 12 becomes convex before connecting the power module 1 to the inverter case 3. First, one end of the ends of the surface of the heat radiating plate 12 is fixed to the inverter case 3 along the bending direction, and then the other end of the surface is fixed to the inverter case 3.

Description

technical field [0001] The present invention relates to a power module (power module) such as an IGBT module and a connection method of the power module. In particular, the present invention relates to a power module in which adhesion to a case is improved to contribute to heat radiation (heat dissipation), and a connection method of the power module. Background technique [0002] Components such as a power module including semiconductor devices such as IGBT devices are mainly connected to a case member such as an inverter case functioning as a cooling body in order to dissipate (radiate) heat generated by the semiconductor devices. [0003] For example, in the case of connecting the inverter case to the power module, thermal grease is filled between the power module and the inverter case so that the heat of the power module is efficiently transferred to the inverter case via the thermal grease. [0004] On the other hand, see Japanese Patent Laid-Open No. Hei 11-163231, a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/36H05K7/20H01L23/40
CPCH01L2924/0002H01L2924/00
Inventor 石松久朋稻垣信明
Owner TOYOTA JIDOSHA KK