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Heat abstractor and method for making same

A heat dissipation device and heat dissipation fin technology, which is applied in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc., can solve the problems of affecting heat conduction effect and increasing air flow resistance, so as to achieve smooth air circulation and improved heat dissipation efficiency , the effect of increased turbulence

Inactive Publication Date: 2007-12-26
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the pitch of the cooling fins is too tight, the air flow resistance will increase and the heat conduction effect will be affected.

Method used

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  • Heat abstractor and method for making same
  • Heat abstractor and method for making same
  • Heat abstractor and method for making same

Examples

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Embodiment Construction

[0019] The present invention will be further described in detail with reference to the accompanying drawings and embodiments.

[0020] Please refer to FIG. 3 , the heat dissipation device 3 according to the first embodiment of the present invention includes: a base 37 ; and a plurality of heat dissipation fins 30 formed on the surface of the base 37 . The heat dissipation fins 30 are L-shaped and made of aluminum, copper or their alloy materials with good thermal conductivity. The heat dissipation fins are closely combined by means of mechanical or welding, and at least one surface of each heat dissipation fin has a plurality of grooves 301 . The base 37 is made of copper, aluminum or its alloy material with good thermal conductivity. In addition, the base 37 also includes a plurality of screw holes 371 at four corners for fixing with electronic devices. Since at least one surface of the heat dissipation fin 30 of the heat dissipation body has a plurality of grooves 301 , the...

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Abstract

This invention relates to a heat dissipation device and process for preparing, which comprises the following parts: a base socket; multiple dissipation fins formed on the surface of the base socket, which at least has multiple grooves on the surface. The process for preparing comprises the following steps: providing a base socket and a screen with array aperture of screen; providing a sheet metal and placing the above screen on it; proceeding fabrography by the relevant metallic etching solution as the printing one with correct reaction time until there are multiple grooves on the surface of the metal; cleaning the sheet metal; punching it to the dissipation fin and assembling multiple dissipation fins and base sockets into the heat dissipation device.

Description

【Technical field】 [0001] The invention relates to a heat dissipation device and a preparation method thereof, in particular to a heat dissipation device with modified surface of heat dissipation fins and a preparation method thereof. 【Background technique】 [0002] At present, in the heat transfer related industries, due to the increase of the operation speed of the processor or chipset, the number of internal transistors continues to increase, and the calorific value also increases with the number of transistors. Therefore, the early heat sinks never need heat sink fins Chips, gradually evolved to add heat dissipation fins, and improved to match heat dissipation fins with fans, but it still cannot meet the heat dissipation requirements of current processors or chipsets. [0003] Now there are heat dissipation modules joined with heat pipes, heat dissipation fins, and fans, which are widely used in various 3C products. The fan in the cooling module provides the main activat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/34H05K7/20G06F1/20
Inventor 简扬昌
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD