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Real-time batch sending system and method during manufacturing process

A technology for manufacturing process and batch delivery, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problem of not taking into account the time spent, quality time management cannot be optimized, and reducing the efficiency of the semiconductor process delivery structure 10 and other issues to achieve the effect of improving efficiency and increasing efficiency

Inactive Publication Date: 2008-06-25
POWERCHIP SEMICON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, because the manufacturing process execution system 14 has to wait for the furnace tube 22 to notify that it is in the standby state, it will order the machine 20 and the furnace tube 22 to execute the corresponding batch of wafer manufacturing process, and the manufacturing process execution system 14 generates a pair of wafers. When ordering the manufacturing process of the machine 20 and the furnace tube 22, the time spent in each manufacturing process on different machines 20 and the furnace tube 22 is not taken into account, so the quality time between the machine 20 and the furnace tube 22 will be caused. The management cannot be optimized, thereby reducing the performance of the semiconductor process delivery structure 10

Method used

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  • Real-time batch sending system and method during manufacturing process
  • Real-time batch sending system and method during manufacturing process
  • Real-time batch sending system and method during manufacturing process

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Embodiment Construction

[0020] Please refer to figure 2 , figure 2 It is a schematic diagram of the real-time batch sending system 30 in the manufacturing process of the present invention. The real-time batch sending system 30 in the manufacturing process includes a real-time sending module 32 , a manufacturing process execution system 34 , an automatic material handling system 36 , an equipment control system 38 , multiple machines 40 and a furnace tube 42 . The wafers can be processed sequentially through the machines 40 and furnace tubes 42 , wherein the machines 40 are used to process the wafers, and the furnace tubes 42 are used to perform thermal oxidation treatment on the wafers. The time for the furnace tube 42 to process wafers is usually longer than the time for each machine 40 to process wafers, which is the bottleneck of wafer processing. In order to optimize the performance of the machine 40 and the furnace tube 42, it is necessary to use To the quality time control (quality-time con...

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Abstract

This invention provides one batch transmission system and its method in manufacture industry, which comprises the following parts: one bottle neck machine, one real-time transmission module to form one batch of files time with multiple product number; one process execution system connected to neck machine and real-time transmission module to receive the batch files of real-time module to choose relative product and to control the products enter neck machine at same time.

Description

technical field [0001] The present invention provides a dispatch system and method in the manufacturing process, especially a dispatch system and method in the manufacturing process that can generate batch files in real time. Background technique [0002] In the manufacturing process, the manufactured product needs to be processed by multiple machines. Since the processing time required by each machine is different, the product that has completed a certain processing procedure enters the next machine for another process. Before the procedure, the next machine must be idle before entering the next machine for manufacturing process. Therefore, machines that require a long processing time are often the bottleneck during processing. Taking the semiconductor manufacturing process as an example, wafers often need to go through multiple semiconductor manufacturing processes to be processed into semiconductor products. For example, wafers are processed by multiple machines, and fin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00
Inventor 彭金郎
Owner POWERCHIP SEMICON CORP