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Electrical or electronic component and method of producing same

An electronic component, electrical technology, applied in the field of plastic packaging, which can solve the problems of use and application restrictions, no indication, etc.

Inactive Publication Date: 2008-06-25
NXP BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] However, all of the subject matter disclosed in the above-mentioned prior art printed publications have in common that, since in each case only the positive to make electrical contacts, so their possible use and applications are limited
Additionally, none of the above-mentioned prior art printed publications teaches an efficient and inexpensive way to make a vacuum-tight and reliable method of enclosing a device with a plastic encapsulant on all sides

Method used

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  • Electrical or electronic component and method of producing same
  • Electrical or electronic component and method of producing same
  • Electrical or electronic component and method of producing same

Examples

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Embodiment Construction

[0031] Embodiments of the present invention are illustrated with reference to FIGS. 1A-15 , which are shown in FIGS. 1A-14B for fabricating an electrical or electronic component 100 (i.e., at wafer level, using step-by-step packaging for chip-scale packaging) to achieve The final product (=electrical or electronic component 100, cf. Fig. 15) is obtained by encapsulation step by step in a plastic case.

[0032] As can be seen from FIGS. 1A and 1B , the starting material used in this case is a so-called "silicon wafer", i.e. a plate-shaped or disc-shaped substrate 10 of semiconducting material, which is fully fabricated at the chip level. processed, and preferably ground to a thin state (for the purposes of semiconductor technology, the boundary between two chips (20g) is indicated by a dashed line in Fig. 10v has a plurality of contacts 30 in the form of so-called metal bond pads; the bottom or backside 10r of the chip is metallized and used to make electrical contacts during t...

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Abstract

To refine an electrical or electronic component having at least one discrete or integrated device formed from a wafer, in plate or disk form, of semiconductive or insulating material, the front face of which device has at least one protruding electrode and is encapsulated by at least one front-face encapsulant, the side faces of which device are at least partly encapsulated by at least one side-face encapsulant, and the rear face of which device is encapsulated by at least one rear-face encapsulant, and to refine a method of producing the same, in such a way that, with the aim of widening the possible uses and applications, electrical contact is made not solely with the front face of the device that is to be housed in the plastics package of very small dimensions, it is proposed that both the side-face encapsulant and the rear-face encapsulant be formed at least partly of layers, but with the layers connected, of electrically conductive material.

Description

technical field [0001] The present invention generally relates to the technical field of assembling discrete or integrated devices into very small size plastic packages. [0002] In particular, the invention relates to electrical or electronic components having at least one discrete or integrated device formed in a wafer of plate-shaped or disc-shaped semiconducting or insulating material, the front side of which device has at least one overhanging and / or protruding And in particular spherical or spherical electrodes and sealed by at least one front side sealant, the sides of the device are at least partially sealed by at least one side sealant and the rear side of the device is sealed by at least one backside sealant. [0003] The invention further relates to a method of making an electrical or electronic component, wherein [0004] [A] forming and / or thickening at least one overhanging and / or protruding contact on the front side of a plate-shaped or disk-shaped wafer of sem...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L21/56H01L23/12
CPCH01L2924/01042H01L21/561H01L2924/01005H01L2924/12041H01L2924/01057H01L2924/01082H01L2924/01039H01L24/96H01L23/3107H01L2924/01013H01L21/56H01L2924/01015H01L2924/01023H01L2924/01029H01L24/97H01L23/3192H01L2924/01012H01L2924/19043H01L2924/10253H01L2924/01006H01L2924/01078H01L2924/01033H01L23/3135H01L2924/00H01L23/02
Inventor M·多伊斯彻尔
Owner NXP BV