Unlock instant, AI-driven research and patent intelligence for your innovation.

Temp detecting device and circuit substrate installed with same

A technology for detecting components and components, which is applied in the direction of resistors, circuits, thermometers, etc. with positive temperature coefficients, can solve the problems of affecting detection accuracy, inability to configure, and differences in thermal conditions of temperature detection components, and achieve high detection accuracy and high The effect of precision detection temperature

Inactive Publication Date: 2008-07-23
MURATA MFG CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conventional temperature detection elements, depending on the arrangement relationship between the wiring on the circuit board and other components, sometimes cannot be placed close enough to the temperature detection target components, resulting in the inability to detect temperature with high accuracy.
In addition, since not only the positional relationship between the heat source and the temperature detection element, but also the surrounding conditions and the heat dissipation coefficient of the substrate can cause differences in the thermal conditions of the temperature detection element, it is easy to affect the detection accuracy.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Temp detecting device and circuit substrate installed with same
  • Temp detecting device and circuit substrate installed with same
  • Temp detecting device and circuit substrate installed with same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] exist Figure 1 to Figure 3 In , an example of an embodiment of the temperature detection element of the present invention is shown. figure 1 It is a perspective view showing the appearance of a positive temperature coefficient thermistor as an example of a temperature detection element, figure 2 It is a plan view showing the positive temperature coefficient thermistor mounted on the board and its peripheral parts, image 3 It is a vertical cross-sectional view showing a positive temperature coefficient thermistor mounted on a substrate and its peripheral parts.

[0040] refer to figure 1 , The positive temperature coefficient thermistor 1, as a chip-type component, is composed of an element main body 3, electrode parts 4, 5, and a heat receiving part 6.

[0041] The element body part 3 is formed with barium titanate (BaTiO 3 ) as the main body is formed in a horizontally long cuboid shape.

[0042] The electrode portions 4 and 5 are joined to both end surfaces ...

Embodiment 2

[0048] Embodiment 2, which is different from Embodiment 1, will be described with reference to the accompanying drawings. Figure 4 (a) shows a perspective view of a temperature detection element, Figure 4 (b) is a side cross-sectional view of a longitudinal section of the heat receiving part of the temperature detecting element.

[0049] refer to Figure 4 A positive temperature coefficient thermistor 1, as a chip component, includes: a cuboid element body 3, electrode portions 4, 5 disposed at both ends of the element body 3, and a heat receiving portion 6. The heat receiving part 6 is provided on the surface of the element main body part 3 in a laminated state between the electrode parts 4 and 5 .

[0050] The heat receiving part 6 of the positive temperature coefficient thermistor 1 has an insulating layer 10, a metal thin film 11, and a protrusion 12 as a conductor. The insulating layer 10 is composed of silicone rubber or silicone resin film sheets attached to the tw...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provided a temperature sensing element 1 which has electrodes 4, 5 on the surface of an element body 3, and has a heat accepting portion 6 of high thermal conductivity on the surface of the element body 3 independently of the electrodes 4, 5. Especially, the temperature sensing element 1 is a positive- characteristic thermistor comprising a chip type component. The invention provided the temperature sensing element whose temperature sensibility for temperature sensing objects can be made high and which can sense a temperature highly stably with high accuracy.

Description

technical field [0001] The present invention relates to a temperature detecting element such as a thermistor and a circuit board equipped with it. Background technique [0002] With the development of miniaturization of electronic equipment, measures to dissipate heat from components such as power transistors and power supply ICs arranged in them have become increasingly important. For this reason, there is an increasing need to be able to detect the temperature of such components with high precision. Based on this fact, there is an increasing demand for temperature detection elements that detect the temperature of components such as these power supplies. [0003] Figure 10 A chip-type positive temperature coefficient thermistor is shown as an example of such a temperature detection element. This positive temperature coefficient thermistor 1 has an element body portion 3 and electrode portions 4 and 5 . Electrode portions 4 and 5 are provided for soldering on the wiring ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L37/00H01C7/02G01K7/16H10N15/00G01K3/00H01C7/00
CPCG01K3/005H01C7/008H01C7/02
Inventor 久村聪井上英浩
Owner MURATA MFG CO LTD