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Non-fan chip heat radiator

A chip heat dissipation, fanless technology, applied in the direction of cooling/ventilation/heating transformation, instruments, semiconductor devices, etc., can solve the problems of limited life, high heat of cooling chips, crashes, etc., to achieve good vibration resistance, no noise interference, The effect of simple structure

Inactive Publication Date: 2008-08-20
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

Therefore, the computer that works quickly in this environment not only has to bear the influence of its own heat, but also suffers from the serious erosion of dust and soot. Solve the heat dissipation problem, and because the fan is a mechanical product with a limited lifespan and high noise, it will often cause shutdowns and fan noise troubles, coupled with unresolvable dust and oily smoke, not only the poor heat dissipation of the computer, but also frequent crashes , and even cause corrosion of circuits and components
Invention Patent No. 200510026459.X discloses a fanless cooling device, which mainly uses a semiconductor cooling chip and a heat dissipation metal sheet to cool down. Although the noise of the fan is avoided, the heat generated by the hot end of the cooling chip is quite large and is directly discharged to the The heat dissipation of other chips in the chassis is not good, and at the same time the whole device is relatively large, it can only dissipate heat for one CPU, and the main board is required to be a passive main board
Invention Patent No. 200510087127.2 discloses a fanless heat dissipation device, which further improves the heat dissipation effect of the computer by adopting the compression structure of the heat conductor, the heat sink with fins and the heat source assembly, and the pollution of dust and oil fume is published There is no description in the document, but according to the structural analysis of the cooling device, if the device needs to be covered with a casing, it can control dust and oily smoke to a certain extent, but heat dissipation will be affected. If the casing is not added, the dust cannot be solved. and oil fume pollution. In addition, the connection structure between the device and the chassis is relatively complicated, and the heat will be discharged to the inside of the chassis while dissipating heat, resulting in a poor working environment for the entire electronic device.

Method used

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Embodiment Construction

[0012] Below in conjunction with accompanying drawing, take common horizontal computer Pentium P4 main board as example, the present invention is described in further detail.

[0013] see figure 1 , according to the fanless chip cooling device that the present invention makes, it comprises the cooling case 1 with metal fin 2, heat-conducting rubber 3 and refrigeration chip 8, and cooling case 1 adopts the alloy (such as aluminum alloy) with good thermal conductivity to make, The size of the cooling case 1 (not including the fins) is 500mm×500mm×300mm. The metal fins 2 and the cooling case 1 have an integrated structure, with a height of 20mm and a width of 5mm. The interval between the metal fins 2 is 5mm, which is set at equal intervals. For the convenience of installation, the cooling case 1 can be divided into upper and lower parts. The upper and lower parts pass through Screw connection, there is a groove guide rail 4 at the position corresponding to the chip 6 inside the...

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Abstract

The present invention discloses a fan chip-free heat radiating device used in particular applicable to an industrial field with serious dust, pollution or vibration The present invention is characterized in that the present invention directly adopts a machine box with a metal fin as a heating radiating body, and takes a heat conducting rubber block corresponding to a chip that needs to radiate as a heat conductor, and is firmly connected with a heat conducting rubber hot end though a groove in the machine box, the cold end of the heat conducting rubber is closely touched with the chip that needs to radiate through a refrigeration chip, the heat radiation performed or the accurate temperature control performed to more chips is simultaneously realized, the polluted environment of the dust and the oil fume can be completely separated, simultaneously, a clamping and fixing function to the chip is provided. The heat radiating efficiency and the freedom from vibration of the present invention is better, the accurate temperature control can be performed, and the structure is simple, stable and reliable, the noise interference is free, the present invention can be widely applied to various electronic and electric equipments and products, in particular to an industrial field with serious dust, pollution or vibration and in particular to electronic and electric equipments and products of a quiet occasion.

Description

a technical field [0001] The invention relates to a chip heat dissipation device, in particular to a fanless chip heat dissipation device suitable for industrial sites with severe dust, pollution or vibration and occasions where quietness is particularly required. Two background technology [0002] Industrial production sites are often accompanied by serious dust, oil fume and other particulate matter pollution. Therefore, the computer that works quickly in this environment not only has to bear the influence of its own heat, but also suffers from the serious erosion of dust and soot. Solve the heat dissipation problem, and because the fan is a mechanical product with a limited lifespan and high noise, it will often cause shutdowns and fan noise troubles, coupled with unresolvable dust and oily smoke, not only the poor heat dissipation of the computer, but also frequent crashes , and even cause corrosion of circuits and components. Invention Patent No. 200510026459.X disclo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20G06F1/20H01L23/36
Inventor 赖长缨江剑石秀东钱林方
Owner NANJING UNIV OF SCI & TECH
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