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Method and structure for measuring thin-membrane strain

A thin film and measurement technology, applied in the direction of measuring devices, optical devices, instruments, etc.

Inactive Publication Date: 2008-12-10
DELTA ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to solve the defects of the existing method of measuring thin film strain and its structure, relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time. This is obviously the relevant industry's eagerness to solve The problem

Method used

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  • Method and structure for measuring thin-membrane strain
  • Method and structure for measuring thin-membrane strain
  • Method and structure for measuring thin-membrane strain

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0114] [Example 1] Straight arm type micro vernier strain gauge

[0115] See figure 1 Shown is the structural schematic diagram of the straight-arm micro-cursor strain gauge design. The straight arm micro cursor ruler strain gauge 100, its design concept is to use a pair of cantilever structural beams (length L A ), as the detection beams 102 and 104 to sense the residual strain of the film, and convert it into the deformation of the detection beams 102 and 104. Detect beams 102 and 104 to extend beam 110 (length L B ) Is connected to the central disc 106, and then the central disc 106 (radius R) and the index beam 108 (length L C ) To enlarge the deformation of the detection beams 102 and 104, and finally read the deformation of the index beam 108 with a micro vernier, and then use the deformation to match the geometric dimensions of the index beam 108 and the detection beams 102, 104, and calculate The residual strain value of the film to be tested. Since the residual strain is...

Embodiment 2

[0120] [Example 2] Arc arm micro vernier strain gauge

[0121] See figure 2 Shown is the structure diagram of the arc arm micro vernier strain gauge. The arc-arm microcursor strain gauge 200 uses a pair of arc-shaped cantilever detection beams 202, 204 with a radius of R opening angle θ to sense the residual strain of the film, and then through a linkage mechanism and an index beam 206 (length L), Convert the strains of the detection beams 202 and 204 into rotational displacements and enlarge them, and then read the enlarged rotational displacements with the microcursor, and then match the geometric dimensions of the index beam 206 to obtain the film to be measured after calculation The residual strain value. If the rotation of the microcursor ruler is also regarded as a small angle rotation, the relationship between its rotational displacement and the residual strain can be simplified as follows through geometric calculation:

[0122] ϵ = y...

Embodiment 3

[0130] [Example 3] High resolution arc arm micro vernier strain gauge

[0131] It has been found that the reason why the arc-arm micro vernier cannot be as good as the straight-arm micro vernier has a high resolution of about 10-5 is that in its measurement mechanism, the two structural beams are applied to the force arms of the index beam at the same time. It is also the radius of the circular arc arm, and the radius, the opening angle, and the arc length are dependent on each other, so after mathematical calculation, the amplification effect of the force arm will be eliminated. Therefore, when designing micro-cursor strain gauges, we must avoid such a situation. Under such considerations, the use of straight-arm micro-cursors is a better choice, but the high area of ​​the straight-arm micro-cursor is occupied. Rate is the main factor limiting its application. However, if the advantages of the arc-arm micro-cursor and the advantages of the straight-arm micro-cursor can be capture...

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Abstract

A method and its structure for measuring film strain includes forming the same plane strain gauge and an out plane strain gauge at time of microelectromagnetic component film being formed. The two formed gauge can be used to measure film residual strain and gradient distribution, and can be used to measure thermal expansion coefficient and gradient distribution after the film is heat-treated.

Description

Technical field [0001] The invention relates to a measurement method and device in a metrology detection equipment, in particular to a method and structure for measuring the strain of a thin film or the coefficient of thermal expansion in a surface microfabrication process. -film strain measurement and themeasurement structure of the same). Background technique [0002] The surface microfabrication process has higher manufacturing flexibility for three-dimensional components than the bulk microfabrication process. Therefore, it has gradually become one of the popular MEMS processing technologies in recent years. In the past, there have been many surface microfabrication technologies. The manufactured micro-system components, such as optical scanning system, micro-motor, micro-actuator and other components, can be integrated to form a micro-electro-mechanical system. However, to make the entire micro-electro-mechanical system have good performance, in addition to In addition to th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/16G01B11/02
Inventor 蔡欣昌方维伦
Owner DELTA ELECTRONICS INC