Radiator structure

A heat dissipation structure and heat dissipation body technology, applied in cooling/ventilation/heating transformation, instrument cooling, instrument and other directions, can solve the problems of accelerated heat dissipation, damage, unusability, etc., achieve good heat dissipation effect, low cost, and simple production Effect

Inactive Publication Date: 2009-03-04
INVENTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As shown in the figure, a cooling element 21 is added to the heating element 20, and a fan 22 is added to the cooling element 21 to provide active convective air through the fan 22 to accelerate the convection between the cooling element 21 and the outside air to make the heat Dissipation, although this existing technology can improve the heat dissipation efficiency of heating elements, it undoubtedly greatly increases the thickness and volume of the product, so it is difficult to apply to all heating elements on the circuit board, especially miniaturized products cannot be used
In addition, when an overweight cooling element 21 and fan 22 are added to the heating element 20, it must be assembled and fixed by fasteners with greater bonding strength, so that it is easier to damage the heating element 20 such as chips due to improper installation.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] image 3 Shown is a schematic diagram of Embodiment 1 of the heat dissipation structure of the present invention. The heat dissipation structure is applied to a circuit board 4 having an electrical connection pad 40 for connecting at least one heating element 41 on the surface. The heat dissipation structure includes at least a heat dissipation body 30 and Heat conductor 31. The radiator 30 is embedded in the circuit board 4, the thermal conductor 31 is embedded in the circuit board 4 and connected to the electrical connection pad 40 and the radiator 30, and is connected to the heating element on the electrical connection pad 40. The heat of 41 is conducted to the radiator 30 , and the heat generated by the heating element 41 is dissipated by the radiator 30 .

[0021] The circuit board 4 used in the present invention can be, for example, a multilayer laminated circuit board, and a plurality of electrical connection pads 40 (such as welding pads (Solder Pad)) are forme...

Embodiment 2

[0027] see Figure 4 , which is a schematic diagram of Embodiment 2 of the heat dissipation structure of the present invention. This heat dissipation structure is also applied to a circuit board 4 having an electrical connection pad 40 on the surface for connecting at least one heating element 41 as in Embodiment 1. The heat dissipation structure It also includes at least a radiator 30 and a thermal conductor 31 . The difference between this embodiment 2 and embodiment 1 is that each of the thermal conductors 31 is not only connected to the heat sink 30 by the electrical connection pad 40, but also penetrates to the bottom surface of the circuit board 4, so that the heat sink 30 passes through Each of the heat conductors 31 can further conduct heat to the outside. It is adapted to the general design that the circuit board 4 is arranged in the electronic device and is attached to one side of the case, and the heat conducted from the bottom surface of the circuit board 4 can be...

Embodiment 3

[0029] FIG. 5 is a schematic diagram of Embodiment 3 of the heat dissipation structure of the present invention. This heat dissipation structure is also applied to a circuit board 4 having an electrical connection pad 40 for connecting at least one heating element 41 on the surface as in Embodiment 2. The heat dissipation structure It includes at least a radiator 30 and a thermal conductor 31 . The difference between the present embodiment 3 and the embodiment 2 is that each thermal conductor 31 penetrates beyond the bottom surface of the circuit board 4, and is also connected to a bottom radiator 30' located at the bottom surface of the circuit board 4. In this way, the heat dissipation body 30 can further conduct heat to the bottom heat dissipation body 30' of the outside through the heat conductors 31, thereby further improving heat dissipation efficiency.

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PUM

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Abstract

The invention comprises a heat-sink berried at the inner part of the circuit board; heat conductor berried at the inner part of the circuit board and electrically connected to the electrical connection pad and the heat-sink for transmitting the heat from the heating element on the electrical connection pad to the heat-sink which will radiate the heat from the heating element.

Description

technical field [0001] The invention relates to a heat dissipation structure, in particular to a heat dissipation structure applied in a circuit board. Background technique [0002] With the rapid development of electronic products, while users have higher requirements for functions, they also have stronger requirements for portability, such as notebook computers, mobile phones, personal digital assistants (Personal Digital Assistant; PDA) and so on. In order to conform to the development trend of miniaturization of electronic products, the package size of the internal components of the above-mentioned electronic products also tends to be miniaturized, especially the surface package components with faster processing speed or larger heat generation on the circuit board (such as central processing unit, power supply device, etc.) etc.) becomes particularly important. If the heat generated by these components cannot be transferred and dissipated in a timely manner, the accumula...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H05K1/02G06F1/20H01L23/36G12B15/06
Inventor 韦啟锌范文纲
Owner INVENTEC CORP
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