The invention provides a glass
blind hole machining method. The glass
blind hole machining method comprises the steps of: a, carrying out
deep hole etching; b, depositing an adhesion layer on the sidewalls of deep holes: b1, dispensing a
high polymer solution on the surface of a glass substrate to ensure that the
high polymer solution covers the surface of the glass substrate; b2, transferring the glass substrate to an environment of which the pressure is lower than
atmospheric pressure, and standing the glass substrate so that the deep holes are filled with the
polymer solution; b3, fixing the glass substrate to a rotary disc, and driving the rotary disc to rotate to thrown away the
high polymer solution on the surface of the glass substrate and in the deep holes, wherein the center of the glass substrate deviates from the rotation center of the rotary disc; b4,
drying to cure the residual high
polymer solution on the surface of the glass substrate and the side walls of the deep holes to form a high
polymer adhesive film; c, depositing a seed layer on the side walls; d, filling
copper in the deep holes; and e, conducting surface CMP and RDL wiring manufacturing. The TSV preparedby adopting the glass
blind hole machining method has high thermal-
mechanical reliability and excellent electrical properties, can be used for
processing deep holes with the aperture of 3 microns andthe depth of 45 microns, and conforms to the development trend of TSV
miniaturization.