Glass blind hole machining method

Abstract

The invention provides a glass blind hole machining method. The glass blind hole machining method comprises the steps of: a, carrying out deep hole etching; b, depositing an adhesion layer on the sidewalls of deep holes: b1, dispensing a high polymer solution on the surface of a glass substrate to ensure that the high polymer solution covers the surface of the glass substrate; b2, transferring the glass substrate to an environment of which the pressure is lower than atmospheric pressure, and standing the glass substrate so that the deep holes are filled with the polymer solution; b3, fixing the glass substrate to a rotary disc, and driving the rotary disc to rotate to thrown away the high polymer solution on the surface of the glass substrate and in the deep holes, wherein the center of the glass substrate deviates from the rotation center of the rotary disc; b4, drying to cure the residual high polymer solution on the surface of the glass substrate and the side walls of the deep holes to form a high polymer adhesive film; c, depositing a seed layer on the side walls; d, filling copper in the deep holes; and e, conducting surface CMP and RDL wiring manufacturing. The TSV preparedby adopting the glass blind hole machining method has high thermal-mechanical reliability and excellent electrical properties, can be used for processing deep holes with the aperture of 3 microns andthe depth of 45 microns, and conforms to the development trend of TSV miniaturization.

Description

technical field [0001] The invention relates to the technical field of manufacturing a three-dimensional integrated package adapter board, in particular to a method for processing a glass blind hole. Background technique [0002] 3D packaging is currently the most mature integration category in the industry. It mainly stacks bare chips or individually packaged chips together through packaging. It currently includes many different technologies, most of which are the extension of existing single-chip packaging technology to the three-dimensional direction. . The interposer, also known as the insertion layer or the middle layer, is a new type of electronic substrate that can realize the connection between the fine-pitch I / O at the top die level and the larger-sized and large-pitch I / O at the bottom package level. interconnection between. The glass transfer board is a new type of transfer board. There are many glass blind vias on the glass transfer board. The glass blind vias ...

AI Technical Summary

Problems solved by technology

[0010] It can be seen that there is still a lack of preparation solutions that not only meet the development trend of future TGV miniaturization and high-frequency applications, but also take into account high versatility, low process temperature, compatibility with traditional CMOS processes, and low cost.

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