Wire rod laser cutting machine and laser cutting method thereof

Abstract

The invention discloses a wire rod laser cutting machine and a laser cutting method thereof. The wire rod laser cutting machine comprises a laser cutting device, a wire clamping jig, a clamping mechanism, a turnover mechanism and a displacement mechanism. The clamping mechanism is fixedly arranged on the turnover mechanism. The turnover mechanism is movably arranged on the displacement mechanism.The wire clamping jig is fixed to the clamping mechanism in a selectable manner. The laser cutting device comprises a laser head. The displacement mechanism selectively moves the clamping mechanism toget close to or away from the laser head. By arranging the laser head, turnover of a wire rod can be achieved through the clamping mechanism, the turnover mechanism and the displacement mechanism, and in this way, the laser cutting operation of the front face and the back face of the wire rod can be completed through one laser head, the structure of the laser cutting device is simplified and optimized, the manufacture cost of the device can be reduced, and the size of the whole cutting machine can be smaller. In addition, by omitting a laser function part, the electronic control part of the whole cutting machine can be simpler, and the operation stability and reliability are both substantially improved.

Description

technical field [0001] The invention relates to the technology in the field of wire laser cutting, in particular to a wire laser cutting machine and a laser cutting method thereof. Background technique [0002] With the advancement of science and technology, some electronic industries at this stage, such as integrated circuit boards, often need to be connected with upper cables. However, when soldering the cable, sometimes the aluminum foil or insulating layer on the outer layer of the cable must be removed. The traditional laser cutting machine for cutting the aluminum foil or insulating layer on the outer layer of the wire generally adopts a double laser head structure, which is set up as a mirror image up and down. Laser cutting operations are performed on both sides. [0003] However, the dual laser head structure will increase the manufacturing cost and the power will be increased at the same time. Therefore, it is necessary to use high-voltage and high-power supporti...

AI Technical Summary

Problems solved by technology

[0003] However, if the double laser head structure is adopted, the double laser head will increase the manufacturing cost, and the operation will increase the power at the same time. Therefore, it is necessary to use high voltage and high power supporting products to ensure its reliable operation.

It can be seen that the overall structure of the equipment is large, the space that needs to be placed is large, and the investment cost is high, which does not conform to the current development trend.

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