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Optical element packaging method and its packaging structure

A technology of optical components and packaging methods, which is applied in the manufacture of electrical components, semiconductor devices, semiconductor/solid-state devices, etc., can solve problems such as the inability to use photosensitive components for alignment, and achieve the effect of improving process yield

Active Publication Date: 2009-03-18
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a packaging method and structure for optical elements, which can improve the problem of inability to use photosensitive element alignment in the prior art

Method used

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  • Optical element packaging method and its packaging structure
  • Optical element packaging method and its packaging structure
  • Optical element packaging method and its packaging structure

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Embodiment Construction

[0011] Please refer to Figure 2A to Figure 2H , which shows a flow chart of packaging an optical element according to a preferred embodiment of the present invention. The packaging method of the optical element in this embodiment includes the following steps. First, as shown in FIG. 2A , a substrate 100 is provided, on which a plurality of optical elements 110 are disposed, and the substrate 100 has at least two first alignment patterns 102 , 104 . The substrate 100 is preferably a CMOS wafer. At the same time, if Figure 2B As shown, a spacer 120 is provided, and the spacer 120 has several openings 125 and at least two through holes 122 , 124 . The spacer 120 is preferably formed by wafer etching, and its detailed formation steps are as follows. In the process of making the spacer, a wafer is provided, and a patterned photoresist layer is formed on the wafer, and finally several openings 125 and at least two through holes 122, 124 are etched on the wafer according to the...

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PUM

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Abstract

An optical component encapsulation method is provided, which comprises the following procedures: first of all, provide a basal material and configure a plurality of optical components on the surface of the basal material; the basal material is provided with at least two first contraposition patterns; then, provide a spacing material; the spacing material is provided with a plurality of openings and at least two through holes; then, point the plurality of openings to the plurality of optical components by utilizing the plurality of first contraposition patterns and through hole; then, join the basal material and the spacing material; then, provide a glass basal plate with at least two second contraposition patterns; finally, join the spacing material and the glass basal plate by utilizing the plurality of second contraposition patterns and through hole.

Description

【Technical field】 [0001] The present invention relates to a packaging method and a packaging structure, and in particular to a packaging method and structure of an optical element. 【Background technique】 [0002] Since the development of the projector industry, technologies have evolved from image tube (CRT), amorphous silicon (a-Si), polysilicon (p-Si) to the so-called digital micromirror device (Digital Micromirror Device, DMD) and LCOS (Liquid Crystal On Silicon) Reflective LCD projection. From a market point of view, with the advancement of projector technology, projector products are small in size, light in weight, and easy to carry, coupled with the continuous improvement in the performance of notebook computers and the increasing sales volume and popularity, which in turn drives the popularity of multimedia presentations , so that the projector products that were originally based on the office automation (OA) market will not only develop in the consumer electronics m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50H01L33/00
Inventor 许健豪
Owner ADVANCED SEMICON ENG INC