Supercharge Your Innovation With Domain-Expert AI Agents!

Transport method and transport apparatus for semiconductor wafer

A technology of transportation device and transportation method, which is applied in the direction of transportation and packaging, semiconductor/solid-state device manufacturing, and printing equipment, etc., which can solve the problems of reduced output and defects, and achieve the effect of avoiding the reduction of output

Inactive Publication Date: 2009-05-13
NITTO DENKO CORP
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in recent years, the front or rear surface of the wafer has come into contact with a wafer holding device such as an alignment stage or a wafer chuck table on almost the entire surface area of ​​the wafer; therefore, dust (foreign matter) generated by the contact is significantly accumulated on the On the wafer holding device, the dust attached to the wafer increases with the number of other wafers processed, which has resulted in defective products and reduced yield

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Transport method and transport apparatus for semiconductor wafer
  • Transport method and transport apparatus for semiconductor wafer
  • Transport method and transport apparatus for semiconductor wafer

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0054] 1 is a partially cutaway perspective view of the entire structure of an embodiment of a semiconductor wafer mounting apparatus equipped with a semiconductor wafer transport apparatus according to the present invention. Note that in this embodiment, an ultraviolet curing adhesive tape as a surface protection tape is attached to the pattern surface (front surface) of the semiconductor wafer W (hereinafter also simply referred to as "wafer W").

[0055] A semiconductor wafer mounting apparatus includes: a wafer supply station 1, wherein a cassette C accommodating a wafer W is loaded, the mask (back mask) of the back surface on the wafer has been completed, and the wafers are stacked into multiple layers; a wafer transport mechanism 3, which has a robot arm 2 that pivots while being bent; a wafer pressing mechanism 4 used to straighten a warped wafer W; an alignment table 5 used as a wafer holding device, on which The upper wafer W is placed-held and aligned; an ultraviolet...

no. 2 example

[0107] In the second embodiment, a structure is adopted in which a first wafer cleaning mechanism 290 is provided instead of the alignment table cleaning mechanism 29 as the dust removal device of the first embodiment.

[0108] Therefore, components having the same structure as those of the first embodiment are attached with the same reference numerals, and detailed descriptions are given only for components having structures different therefrom.

[0109] FIG. 7 is a partially cutaway perspective view of an entire structure of an embodiment of a semiconductor wafer mounting apparatus equipped with a semiconductor wafer transport apparatus according to the present invention.

[0110] Such as wafer cleaning mechanism 290 ( Figure 8 ) side view and top plan view of the main part ( Figure 9 ), the first wafer cleaning mechanism 290 as a dust removal device is arranged near the alignment table 5.

[0111] The first wafer cleaning mechanism 290 is structured as follows: the firs...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

First brush bristles of an alignment stage cleaning mechanism are pressed on a wafer suction stage of the alignment stage before a semiconductor wafer is transported onto the alignment stage, in which state the wafer suction stage rotates to thereby remove dust attached to the wafer suction stage. Moreover, second brush bristles of a wafer chuck table cleaning mechanism are moved on and along a surface facing downward of a wafer chuck table to thereby remove dust attached to the surface facing downward of the wafer chuck table.

Description

technical field [0001] The present invention relates to a transportation method and a transportation device for semiconductor wafers (hereinafter also referred to as "wafers" for the sake of brevity). Background technique [0002] In general, the following procedures have been adopted. In the process of grinding (back grinding) the back surface of the wafer which has completed the pattern forming process, a protective adhesive tape has been pasted on the front surface of the wafer in advance, and the part of the protective adhesive tape protruding from the periphery of the wafer is also cut off. In addition, the wafer whose front surface is all protected with a protective adhesive tape is sucked and held by a suction cup at the front surface thereof, thereby undergoing grinding, and thereafter, its back surface is suction-held on its part to change Wafers are placed and transported to various processing stations. [0003] In recent years, there has been a tendency that th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B65G49/07H01L21/00H01L21/68G03B27/52
CPCH01L21/67028G03B27/52H01L21/68
Inventor 山本雅之
Owner NITTO DENKO CORP
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com