Around exposure device and method thereof

Abstract

The present invention provides a peripheral exposure device and method thereof which can form an identification mark in any position of peripheral region and minimize the substrate surface staining factor. The peripheral exposure device comprises an ultraviolet irradiation unit 9 on the moving path which irradiates the light containing ultraviolet on the peripheral region of the substrate through an irradiation opening and an irradiation lens, and an occluder adjusting mechanism 10 in the irradiation region, which can control the occluder in manner of shading at least part of the irradiation opening 9m to shade the identification mark according to the moving speed of the substrate.

Description

technical field [0001] The present invention relates to a peripheral exposure device and method thereof, which irradiate the peripheral region with ultraviolet light while shielding identification marks such as marks and characters formed in the peripheral region formed around a pattern region of a substrate. light for peripheral exposure. Background technique [0002] Generally speaking, regarding a substrate to be exposed with a pattern in an exposure device, for example, in a liquid crystal substrate, a substrate with a size of about 500mm x 500mm was processed at that time, and a substrate with a large size of 2160mm x 2460mm is now being enlarged. to process. This large substrate is cut and separated into predetermined individual substrate pieces to manufacture a substrate mounted on a general image receiving device. When the substrate is cut and separated from a large state, in order to manage it and the management of the manufacturing process, the laser beam is used...

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Problems solved by technology

[0017] However, in the respective exposure devices, since the absolute position is positioned when the alignment work of the substrate is performed, the references of the respective alignment work are different, and the structure cannot be easily integrated.

[0018] (2) Moreover, when the exposure process of the identification mark and the exposure process of the surrounding area are continuously performed, the moving speed of the substrate will affect the exposure speed of any exposure process.

However, as in Patent Document 4, when the irradiated exposure light expands or contracts symmetrically with respect to the center of the optical path, it cannot correspond to the position where the identification mark is located on the side of the pattern area from the center of the peripheral area. Since exposure is performed without shifting from the moving direction of the pedestal, improvement is desired

[0020] (4) In addition, in the exposure apparatus of Patent Document 5, the width of the substrate must correspond to, for example, from 500 mm to 2460 mm. In this case, if a moving rail or the like is provided above the substrate, the light source unit or the like will move a long distance, There is a possibility that foreign matter may fall onto the substrate and cause contamination of the substrate surface

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