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Method for removing peripheral metal residues of base board

A peripheral and metal technology, applied in chemical/electrolytic methods to remove conductive materials, cleaning/polishing of conductive patterns, secondary treatment of printed circuits, etc., can solve problems such as metal residues

Inactive Publication Date: 2009-07-15
CHUNGHWA PICTURE TUBES LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Solve the problem of metal residue by double exposure, reduce the procedure of continuous re-exposure, reduce cost and time to improve economic benefits

Method used

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  • Method for removing peripheral metal residues of base board
  • Method for removing peripheral metal residues of base board
  • Method for removing peripheral metal residues of base board

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Experimental program
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Embodiment Construction

[0031] The lower substrate of the liquid crystal display device, also known as a thin film transistor (TFT) array substrate, includes: a first metal layer, a semiconductor layer, a second metal layer, an insulating layer and a pixel electrode layer. Wherein, the film forming method of the first metal layer in the present invention is as follows: figure 2 As shown, step S200 deposits a metal layer on the array substrate, please also refer to Figure 3a , the first metal layer 24 is plated on the array substrate 26 in the form of metal coating, and several detection lines are arranged to extend to the edge of the array substrate 26. The detection lines are conductive metal lines and are in the same layer as the metal layer 24, Sectional view along AA' tangent line as Figure 3b Shown; wherein, the array substrate 26 is a part of the mother substrate and is composed of a transparent material, such as glass.

[0032] Step S201 lays out a photoresist layer, please also refer to ...

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PUM

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Abstract

The invention relates to a method for removing metal residues on the periphery of a substrate. A photoresist layer is coated on an array substrate, and a photomask is used to transfer the pattern of a lead wire of a detection circuit, followed by another exposure to remove the photoresist layer on the periphery of the array substrate. It can effectively solve the short-circuit problem of detection signals caused by metal residues, and will not increase the exposure times of the photomask.

Description

technical field [0001] The invention relates to a method for removing metal residues at the periphery of a substrate, and in particular provides a method for removing metal residues at the periphery of a substrate when manufacturing a conductive layer of the substrate. Background technique [0002] Generally, when photoresist coating is carried out in the array substrate manufacturing process of liquid crystal displays, the distribution of photoresist coating thickness is that the periphery of the substrate is thicker than the center of the substrate. Therefore, the peripheral exposure technology will be used before the subsequent processing of the array substrate. The photoresist with a thicker peripheral thickness is removed to avoid subsequent process defects, and this technology will be applied to the stages of photoresist coating to panel exposure in all array substrate manufacturing processes. However, the disadvantage of this technology is that the precision error of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06H05K3/26
Inventor 陈紫瑜黄金海
Owner CHUNGHWA PICTURE TUBES LTD