Structure and making method of the base plate integrating the embedded parts

Abstract

This invention discloses one baseboard structure and its process method, wherein, the integrated imbed element baseboard forms several concaved grooves through removing part of circuit layer and dielectric layer and exposes part inner circuit layer in the groove; the imbed element of passive element is put into concave groove connected to the inner circuit layer exposed out of groove bottom.

Description

【Technical field】 [0001] The invention relates to a substrate structure and a manufacturing method thereof, in particular to a substrate structure for integrating embedded components and a manufacturing method thereof. 【Background technique】 [0002] In the semiconductor manufacturing process, the integrated circuits (integrated circuit, IC) fabricated on the same wafer are usually of the same type, because it will greatly increase the difficulty and complexity of fabricating different integrated circuits on the same wafer. This will lead to increased costs, and there are also disadvantages such as unsatisfactory flexibility of expanded functions, long development time, and time-consuming testing process. However, in order to achieve the required design purpose and function of electronic products, it is not only achieved by one or one integrated circuit, but often needs to be integrated with other components to form a fully functional electronic product. How to integrate va...

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Problems solved by technology

[0004] However, using this electronic assembly method often requires one or more reflows, and such a high-temperature process as reflow will cause the solidified solder to melt and flow, causing the passive components to be unable to be fixed and deviate from the corresponding The position of the welding pad, resulting in flaws or even open circuit in the circuit conduction between the passive component and the welding pad

And the solder on two adjacent pads will gather or bridge due to flow, causing the entire circuit to short circuit and causing serious damage to the product

[0005] Therefore, it is indeed an important research topic in this technical field how to prevent defects such as solder flow and accumulation caused by multiple reflows in the electronic structure of integrated components, bridging, passive component offset and circuit short circuit.

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