Corrosion method of CdTe film solar cell
A thin-film solar cell and thin-film technology, which is applied in circuits, photovoltaic power generation, electrical components, etc., can solve the problems of strong volatility of bromo-methanol corrosive solution, unfavorable industrial production, and toxicity.
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Embodiment 1
[0016] (1) When the temperature of the corrosive solution is controlled at 40°C, the sample is put into the corrosive solution, and the corrosive solution is 65% to 68% nitric acid, 99.5% glacial acetic acid and deionized water in a ratio of 1: 100:40 volume ratio mixing, the added NaAc is 15g / L, and the corrosion time is 1 minute.
[0017] (2) Take out the sample, rinse it several times with deionized water, and dry it with nitrogen.
[0018] (3) Co-sputter high-purity ZnTe target (99.999%) and Cu target (99.999%) by sputtering method or vacuum co-evaporation method to evaporate high-purity ZnTe source (99.999%) and copper source (99.999%), the deposition thickness is about 100nm, annealed at ~190°C, and then deposited ~200nm metal electrode Ni.
Embodiment 2
[0020] (1) When the temperature of the corrosive solution is controlled at 35°C, the sample is put into the corrosive solution, and the corrosive solution is 65% to 68% nitric acid, 99.5% glacial acetic acid and deionized water in a ratio of 1: 100:30 volume ratio mixing, the added NaAc is 15g / L, and the corrosion time is 2 minutes.
[0021] (2) Take out the sample, rinse it several times with deionized water, and dry it with nitrogen.
[0022] (3) Coat the surface of the corroded CdTe with 10% HgTe:Cu / 90% graphite slurry, anneal in nitrogen for 20 minutes at a temperature of 290° C., and then deposit 100 nm of Au as a metal electrode.
Embodiment 3
[0024] (1) When the temperature of the corrosive solution is controlled at 30°C, the sample is put into the corrosive solution, and the corrosive solution is 65% to 68% nitric acid, 99.5% glacial acetic acid and deionized water with a ratio of 1.5: 100:30 volume ratio mixing, the added NaAc is 20g / L, and the corrosion time is 3 minutes.
[0025] (2) Take out the sample, rinse it several times with deionized water, and dry it with nitrogen.
[0026] (3) co-sputtering high-purity Sb target (99.999%) and Te target (99.999%) by sputtering method or vacuum co-evaporation method to evaporate high-purity Sb source (99.999%) and Te source (99.999%), the deposition rate ratio (0.4~0.7), the thickness is about 100nm, annealed to 200°C, and Ni / Al electrode (Ni: 50nm; Al: 3μm) is deposited.
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