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CPU heat radiation module

A heat dissipation module and heat dissipation end technology, applied in energy-saving ICT, cooling/ventilation/heating renovation, sustainable buildings, etc., can solve the problems affecting the normal use and life of notebook computers, heating of notebook computer shells, and low heat conduction efficiency. The effect of reducing the increase in energy consumption, improving the heat dissipation efficiency and reducing the volume

Inactive Publication Date: 2009-11-11
深圳市东维丰电子科技股份有限公司
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  • Application Information

AI Technical Summary

Problems solved by technology

In this traditional heat dissipation structure, since the heat of the CPU is transferred to the heat sink through the heat conduction between metals, and the heat conduction efficiency is low, the notebook computer shell is heated due to the poor heat dissipation effect, which directly affects the notebook computer. Normal use and lifespan of the computer

Method used

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  • CPU heat radiation module
  • CPU heat radiation module
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Examples

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Embodiment Construction

[0015] The following examples are further explanations and illustrations of the present invention, and do not constitute any limitation to the present invention.

[0016] refer to Figure 1 ~ Figure 3 , The CPU cooling module of the present invention includes a centrifugal fan 10 , an end cover 20 , a copper block 30 and a heat pipe 40 .

[0017] Described centrifugal blower 10 is a kind of ultrathin miniature centrifugal blower, as image 3 As shown, the centrifugal fan includes a wind wheel 11, a volute 12 and an end cover 20, and its wind wheel 11 is composed of a wheel frame 111, a wheel body 112 connected to the wheel frame, blades 113 arranged at intervals along the circumference of the wheel body edge, and an assembly. The micro-motor 114 in the wheel body constitutes, the wheel body 112 that blade 113 and micro-motor 114 are housed is placed in the volute 12, and the wheel body 112 can rotate under the micro-motor 114 drive. The wheel frame 111 is an annular plate-sh...

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Abstract

The invention provides a CPU thermal module which is provided with a centrifugal fan (10), wherein, a copper end cover (20) of the centrifugal fan is provided with an expanding part (22), one side of the expanding part is provided with a copper block (30) closely contacted with the CPU, the end cover (20) is provided with a duct heater (40), one end of the duct heater (40) is connected with the expanding part (22) of the copper end cover (20), and the other end of the duct heater (40) is arranged at an air outlet of the centrifugal fan (10). The CPU thermal module of the invention can lead out the heat of the CPU rapidly and discharge out of a machine body rapidly and has the double effects of radiating rapidly and saving energy.

Description

【Technical field】 [0001] The invention relates to a CPU cooling device, in particular to a CPU cooling module used for notebook computers, communication equipment, industrial control equipment, non-standard computers and the like. 【Background technique】 [0002] In notebook computers, communication equipment, industrial control equipment, non-standard computers and other electronic equipment using CPU, it is necessary to solve the heat dissipation problem of CPU, especially for notebook computers, its heat dissipation is one of the biggest technical bottlenecks, and the quality of heat dissipation is directly related to The stability of product operation and the service life of the whole machine. Therefore it is necessary to solve the problem of difficult heat dissipation due to the small size and internal space of the notebook computer and the concentration of heating elements. At present, the most common method is to use a temperature-controlled fan to dissipate heat. The...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/34G06F1/20H05K7/20
CPCY02B60/1275Y02D10/00
Inventor 陈海波黄晓东
Owner 深圳市东维丰电子科技股份有限公司
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