Composition for heat conductive siloxanes heat release and its using method

A technology of thermal conductivity and composition, applied in chemical instruments and methods, semiconductor devices, and other chemical processes, can solve the problems of exothermic electronic parts such as high stress, failure to maintain shape, and damage of exothermic electronic parts, and achieve The effect of good heat release characteristics

Inactive Publication Date: 2009-12-02
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] When there is a wide gap between the electronic component and the heat sink, it is difficult for the grease to apply an amount to fill the gap, and even if it can be applied, there is a problem that it cannot maintain the shape and flow out
[0007] In addition, the gap can be easily filled by using a rubber sheet, but when the gap between the electronic part and the heat-radiating part is narrowed due to ambient temperature or vibration, the stress generated by the heat-radiating electronic part may be too large, and the Damage to exothermic electronic parts

Method used

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  • Composition for heat conductive siloxanes heat release and its using method
  • Composition for heat conductive siloxanes heat release and its using method
  • Composition for heat conductive siloxanes heat release and its using method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] will have 10000mm 2 Viscosity per s, 100 g of dimethyl polysiloxane (Vi group content: 0.00525 mol / 100 g) with vinyl groups at both ends, and 500 g of alumina with an average particle diameter of 1 μm are charged into a Shinagawa-style universal mixer, and mixed for 60 Minutes later, 0.2 g of a 2-ethylhexanol solution of chloroplatinic acid (2.0% by mass of platinum element), 4.0 g of a toluene solution of ethynylcyclohexanol (50% by mass) as a reaction control agent, and the following 5.0 g of organohydrogenpolysiloxane (Si-H group amount: 0.00184 mol / g) represented by formula (7), mixed for 10 minutes for each additive, and finally mixed for 10 minutes under a reduced pressure of -700mmHg, Composition a is obtained.

[0056]

Embodiment 2

[0062] will have 10000mm 2 Viscosity per s, 100 g of dimethyl polysiloxane (Vi group content: 0.00525 mol / 100 g) with vinyl groups at both ends, and 500 g of alumina with an average particle diameter of 1 μm are charged into a Shinagawa-style universal mixer, and mixed for 60 Minutes later, 0.2 g of a 2-ethyl-hexanol solution of chloroplatinic acid (the amount of platinum element is 2.0% by mass), 4.0 g of 3-methyl-1-butyn-3-ol as a reaction control agent, and the above 5.0 g of the organohydrogenpolysiloxane represented by the formula (7) was mixed for 10 minutes with respect to each additive, and finally mixed for 10 minutes under a reduced pressure condition of -700 mmHg to obtain a composition d.

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Abstract

The thermally conductive silicone heat release composition contains: (a) an organopolysiloxane having an alkenyl group, (b) a thermally conductive filler, (c) an organic polysiloxane having an average of 2 or more Si-H groups in the molecule. Hydrogenated polysiloxane in an amount such that the molar ratio of Si-H groups in (c) / alkenyl groups in (a) exceeds 0.6 and is less than 10.0, (d) a platinum group metal-based addition reaction catalyst, and (e) A volatile reaction control agent containing an aliphatic unsaturated group in an amount such that the Si-H group in (c) / [the alkenyl group in (a)+the unsaturated group in (e) ] in a molar ratio of 0.05 to 0.5; during curing (e) volatilizes from the surface, the surface part is cured, and the central part becomes an uncured state. When this composition is filled into the displaceable gap between the object to be heated and the heat dissipation member, and the surface is cured by heating, there is no drooping, and the composition does not peel off from the object to be heated even when the gap is displaced. Excessive stress does not occur in the object to be exothermic, showing good exothermic characteristics.

Description

technical field [0001] The present invention relates to a siloxane exothermic composition mixed with a thermally conductive filler, and particularly relates to a composition for exothermic components mounted on a thermal interface of an exothermic electronic component, a heat sink or a circuit board, etc. for exothermic heat dissipation of an exothermic electronic component Effective thermally conductive silicone exothermic compositions and methods of use thereof. Background technique [0002] Electronic components such as CPUs, excitation ICs, and memories used in electronic equipment generate a large amount of heat themselves due to high performance, high speed, miniaturization, and high integration. . Therefore, various heat radiation methods and heat radiation components used therein for suppressing temperature rise of electronic parts during operation have been proposed. [0003] Conventionally, in electronic devices and the like, in order to suppress temperature rise...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/373C08L83/04C08K3/00C09K3/10C08K5/05C08L83/05C08L83/07
Inventor 朝稻雅弥
Owner SHIN ETSU CHEM IND CO LTD
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