Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Probe measurement device and system

A probe measurement and probe head technology, applied in the field of probe measurement cards, can solve problems such as increased test costs, insufficient probe card area, and shortened life of probe cards.

Active Publication Date: 2009-12-23
POWERCHIP SEMICON MFG CORP
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, due to the current IC requirements of smaller size, stronger functions, and more pins, coupled with the successful development of the power signal sharing (Driver Share) test method, the test machine needs more probes , but the number of probes of the old probe card has not increased. If the traditional probe card is used for chip testing, it will not only be time-consuming and laborious, but also the life of the probe card may be shortened due to excessive wear of the probe head.
In addition, if you want to increase the number of probe heads on the probe card, you will not be able to accommodate all the test components because the area of ​​the probe card is insufficient. Changing the test mother board (Mother Board) of the test machine and the fixing seat of the probe card will greatly increase the cost of testing

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Probe measurement device and system
  • Probe measurement device and system
  • Probe measurement device and system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041] Figure 2a with 2b It is a layout diagram of a probe measuring device according to a preferred embodiment of the present invention. Please refer to Figure 2a with 2b In this embodiment, the area of ​​the circuit board of the traditional probe card is increased, and the layout of each test element on the circuit board is changed at the same time, so that the number of probe heads of the probe card can be increased without changing the test motherboard. , so as to achieve the purpose of improving the test efficiency.

[0042] Such as Figure 2a with 2b As shown, the circuit board 210 of the probe measuring device 200 of the present embodiment is compared with the circuit board 110 of the existing probe card (such as Figure 1a with1b shown) has been enlarged and divided into upper and lower sides, where Figure 2a Shown is the top half, Figure 2b Bottom half shown. exist Figure 2a Among them, a plurality of spring contacts 220 are arranged on the circuit board...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A probe measurement device is prepared for setting test elements larger circuit board and improving layout of test elements on circuit board for enabling to set more test elements on circuit board, furthermore enabling to arrange prepared measurement probe on old tester for raising probe measurement performance of old tester.

Description

technical field [0001] The invention relates to a wafer testing device, in particular to a probe measuring card which changes the layout of components to increase the number of configurable components. Background technique [0002] With the continuous evolution of semiconductor technology, the current transistor channel (Channel Length) has evolved from 0.15 microns to 0.13 microns, and further developed to the latest 90-nanometer process. In the semiconductor process, before the wafer process is completed and the packaging is not cut, in order to ensure the yield of the wafer and avoid the waste of the packaging, the electrical and functional tests at the wafer stage must be carried out first. This test method is to use the test machine and the probe card (Probe Card) to form a test circuit, and directly connect the probe head (Probe Pin) on the probe card to the pad (Pad) or bump (Bump) on the chip Contact, and use the probe to detect each chip on the wafer, so as to lead...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01R1/073G01R1/067G01R31/26H01L21/66
Inventor 许繁贤
Owner POWERCHIP SEMICON MFG CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com