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Aluminium and copper metallized insulated material

A base material and cyclization technology, applied in organic insulators, plastic/resin/wax insulators, organic chemistry, etc., can solve the problem of chip surface size increase and achieve good film quality

Inactive Publication Date: 2010-01-06
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Nevertheless, in order to be able to ensure sufficient operability of these elements, the depth of the substrate is increasingly being used, i.e. these elements have a small area at the chip surface but an increased dimension perpendicular to the chip surface

Method used

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  • Aluminium and copper metallized insulated material
  • Aluminium and copper metallized insulated material
  • Aluminium and copper metallized insulated material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0138] Example 1: Synthesis of Polymer 1

[0139] 38.21 g (0.1 mol) of bisaminophenol 1 was dissolved in 300 ml of distilled N-methyl-pyrrolidone (NMP), and 23.93 g (0.095 mol) of diaminophenol was added dropwise to the solution at 10°C with stirring. A solution of formyl chloride 1 in 200 ml of distilled NMP. Stir at 10°C for one hour and then at 20°C for one hour, then cool to 10°C, add 1.64 g (0.01 mol) of capped 3 (dissolved in 50 ml of distilled γ- Butyrolactone (γ-BL)) and stirred at 10°C for one hour, then at 20°C for one hour, the reaction mixture was cooled to 10°C, and 19.76 g (0.25 mol) of pyridine (dissolved in 30 mL of distilled γ-BL) and the reaction mixture was warmed to room temperature and stirred for 2 hours.

[0140] In order to isolate the polymer, the reaction mixture was filtered and the filtrate was added dropwise to a mixture of 1 liter of demineralized water and 200 milliliters of isopropanol with stirring, and 3 liters of demineralized water were ad...

Embodiment 2

[0142] Example 2: Synthesis of Polymer 2

[0143] 36.3 grams (0.095 moles) of bisaminophenol 1 were dissolved in 300 milliliters of distilled NMP, and 27.8 grams (0.1 moles) of diformyl chloride 2 was added dropwise to the solution in 250 milliliters of distilled NMP at 10°C with stirring. A solution of γ-BL. Stirred at 10°C for one hour and then at 20°C for one hour, and after cooling to 10°C, 80 g (0.02 mole) of bismuth dissolved in 200 ml of distilled γ-BL was added dropwise to the reaction mixture. Aminophenol compound 1 was stirred for one hour at 10°C and then stirred for one hour at 20°C. The reaction mixture was cooled to 10°C and 25.28 g ( 0.25 mol) triethylamine (TEA) and the reaction mixture was warmed to room temperature and stirred for 2 hours.

[0144] To isolate the polymer, the reaction mixture was filtered and the filtrate was added dropwise with stirring to cyclohexane or a mixture of 4 liters of cyclohexane and 2 liters of demineralized water and stirred a...

Embodiment 3

[0146] Example 3: Synthesis of Polymer 3

[0147] 28.31 grams (0.05 moles) of bisaminophenol 2 were dissolved in 250 milliliters of distilled NMP, at 10° C. under stirring, 8.82 grams (0.03 moles) of diformyl chloride 3 and 3.53 grams ( 0.0175 mol) of diformyl chloride 4 in 150 ml of distilled γ-BL solution. After stirring at 10°C for one hour and then at 20°C for one hour, and cooling to 10°C, 0.52 g (0.005 mol) of capped 1 dissolved in 20 ml of distilled γ-BL was added dropwise to the The reaction mixture was stirred at 10° C. for one hour and then at 20° C. for one hour. The reaction mixture was cooled to 10° C., and 9.48 g (0.12 mol ) pyridine and the reaction mixture was warmed to room temperature and stirred for 2 hours.

[0148] The isolation and workup of polymer 3 was carried out in a similar manner to Example 1.

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Abstract

A dielectric for aluminum and copper metalizations is stable at high temperatures. Surprisingly, in spite of the elimination of water during the cyclization, the polymeric dielectrics are very suitable for filling narrow trenches. The filled trenches exhibit no defects and bubbles or cracks. The polybenzoxazoles have dielectric constants of k<=2.7 and are suitable as an electrical insulator. Furthermore, these materials adhere very well on all surfaces relevant for microelectronics.

Description

technical field [0001] The present invention relates to high-temperature stable polymers, their production methods, polybenzoxazoles, and their production methods, electronic components including the polybenzoxazole as a dielectric, and the production method of such electronic components . Background technique [0002] In order to avoid inductive interference of the signals caused by capacitive coupling, the conductor tracks adjacent to each other on the microchip are insulated from each other by a dielectric body placed between the conductor tracks. The material to be used as a dielectric must meet various requirements, therefore, the transit time of a signal in a microchip depends on the material of the conductor tracks and on the dielectric placed between the conductor tracks. The lower the dielectric constant of the dielectric, the shorter the signal transmission time. The silica-based dielectrics used to date have a dielectric constant of about 4, and these materials ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C07D207/27C07D207/40C07D209/58C07D213/24C07D215/12C07C235/02C08G73/22H01B3/30C08G73/02C08G69/26C08G69/32
CPCY10T428/31721C08G73/22Y10T428/31678Y10T428/31681C08G69/32C08G69/265Y10T428/31504C08G69/26C08G73/02
Inventor R·塞滋A·沃尔特A·马坦伯格K·洛瓦克M·哈里克
Owner INFINEON TECH AG