High power light-emitting diode illuminating source heat radiating device

Abstract

The invention relates to a conducting heat sink of an electric light source, in particular to a high power LED light source conducting heat sink. The high power LED heat sink provides a high power LED light source conducting heat sink with reasonable structure and good heat conduction and radiation. The high power LED light source conducting heat sink is used for a high power LED lighting device, and has the advantages of high efficiency and long service life.

Description

technical field [0001] The invention relates to a conduction and heat dissipation device for an electric light source, in particular to a heat conduction and heat dissipation device for a high-power LED light source. Secondary cooling device for high-power light-emitting diode light source in use Background technique [0002] We know that semiconductor lighting is one of the most promising high-tech fields in this century. As a new type of solid-state light source, semiconductor light source will become another leap in the history of human lighting after incandescent lamps and fluorescent lamps. At present, in order to meet the needs of lighting, semiconductor lighting fixtures, especially street lighting fixtures, must be assembled and packaged with multiple high-power chips to meet the design requirements. If the temperature rise cannot be effectively suppressed, the junction temperature will be quickly dissipated in the air, which will directly affect the service life a...

AI Technical Summary

Problems solved by technology

At present, in order to meet the needs of lighting, semiconductor lighting fixtures, especially street lighting fixtures, must be assembled and packaged with multiple high-power chips to meet the design requirements. The temperature rise cannot be effectively suppressed, and the junction temperature will be quickly dissipated in the air, which will directly affect the service life and luminous efficiency of the LED, and even burn the LED

At present, most application manufacturers use a single 1W high-power chip to directly fix the light source on the heat dissipation lamp body when they have not solved the heat conduction solution. This method is easy to dissipate heat due to the low power, but the luminous intensity is not enough. , the effective range is insufficient, and it cannot be used as a light source for elevated street lights, but we also know that most of the electric energy of the light-emitting diodes in the prior art will be converted into heat energy. For LED devices packaged with multiple high-power chips, the large dissipation Power, large calorific value and high light output efficiency cannot be solved by the heat dissipation method and material of a single 1W LED device. If the heat generated by the high-power packaged LED cannot be effectively dissipated in the In the air, the temperature of the high-power integrated package LED chip is easy to be too high, resulting in a serious drop in luminous efficiency, or even burning the light-emitting diode

At present, when high-power light-emitting diodes are assembled and packaged for street lighting, the problem of heat dissipation cannot be solved, so it cannot be adopted and implemented.

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